Rapid Thermal Annealing of Oxygen-Vacancy Centers In O-Implanted Silicon

1987 ◽  
Vol 92 ◽  
Author(s):  
H. J. Stein
Keyword(s):  
Activation Energy ◽  
Oxygen Vacancy ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Infrared Absorption ◽  
Silicon On Insulator ◽  
Vibrational Modes ◽  
Annealing Stage ◽  
Localized Vibrational Modes

ABSTRACTInfrared absorption by localized vibrational modes has been used to investigate rapid thermal annealing (RTA) of oxygen-vacancy (O-V) defects in O-implanted Si. At least three processes are involved in the annealing of O-V defects. An activation energy of 1.0 ± 0.2 eV for a process leading to O-V formation is attributed to O-V diffusion. The final O-V annealing stage is attributed to oxygen clustering around O2-V centers. Processes observed here in RTA are expected to be operative during implantation at the temperatures (400 to 600°C) used for production of silicon-on-insulator structures.

Activation energy forC94 andC54 TiSi2formation measured during rapid thermal annealing

1994 ◽  
Vol 65 (16) ◽  
pp. 2009-2011 ◽  
Author(s):  
E. G. Colgan ◽  
L. A. Clevenger ◽  
C. Cabral
Keyword(s):  
Activation Energy ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing

Thermal Donor Removal by Rapid Thermal Annealing: Infrared Absorption

1985 ◽  
Vol 46 ◽  
Author(s):  
Herman J. Stein ◽  
S. K. Hahn ◽  
S. C. Shatas
Keyword(s):  
Excited State ◽  
High Temperature ◽  
Excited States ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Infrared Absorption ◽  
Excited State Absorption ◽  
Thermal Donor ◽  
Oxygen Cluster ◽  
Oxygen Precipitates

AbstractRapid thermal annealing of thermal donors in Si with 10 sec anneal times at temperatures between 600 and 1000 °C has been investigated by infrared absorption at 80 K. Thermal donors A through D, which are identified by excited state absorption, are present in as-grown Czochralski Si; whereas excited states for donors A through F as well as photoionization of thermal donors are observed after extended heating at 450 °C. The temperature required for rapid thermal annealing is lower when only donors A through D are present. Removal of thermal donors A through F by rapid thermal annealing at temperatures > 800°C restores 7 to 8 oxygen atoms to interstitial sites per electricallӯ measured donor removed. This ratio supports oxygen cluster models for thermal donors but does not support previous suggestions that such clusters are embryonic forms of high temperature oxygen precipitates.

Secondary Grain Growth in Heavily Doped Polysilicon During Rapid Thermal Annealing

1991 ◽  
Vol 230 ◽  
Author(s):  
S. Batra ◽  
K. Park ◽  
M. Lobo ◽  
S. Banerjee
Keyword(s):  
Grain Size ◽  
Film Thickness ◽  
Grain Growth ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Silicon On Insulator ◽  
Active Devices ◽  
Drastic Increase ◽  
Heavily Doped ◽  
Soi Technology

AbstractTo successfully implement Silicon-on-Insulator (SOI) technology using polysilicon-on-oxide, it is necessary to maximize the grain size such that the active devices are entirely within very large single crystal grains. A drastic increase in grain size in polysilicon has been reported due to secondary grain growth in ultra-thin, heavily n-type doped films upon regular furnace annealing. Very little work has been undertaken, however, to study secondary grain growth during Rapid Thermal Annealing (RTA).This paper is a study of the grain growth mechanism in heavily P-doped, amorphous silicon films during RTA. Secondary grains as large as 16 μm have been obtained in 160 nm thick films after a 180 s RTA at 1200 °C, representing a grainsize- to-film-thickness-ratio of 100:1. This is the largest secondary grain size and grain-size-to-film-thickness reported in the literature. A detailed analysis of negatively charged silicon vacancies has also been employed to explain the lower activation energy (1.55 eV) of secondary grain growth compared to that of normal grain growth (2.4 eV).

Rapid Thermal Annealing of Spin-On Glass Films

1992 ◽  
Vol 284 ◽  
Author(s):  
Laurent Ventura ◽  
Bouchaíb Hartiti ◽  
Abdelilah Slaoui ◽  
Jean-Claude Muller ◽  
Paul Siffert
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Absorption Spectroscopy ◽  
Infrared Absorption ◽  
Electrical Measurement ◽  
Infrared Absorption Spectroscopy ◽  
Insulating Films ◽  
State Densities ◽  
Interfacial State ◽  
Glass Films

ABSTRACTRapid thermal annealing is investigated for curing spin-on glass insulating films. The annealed SOG films were mainly evaluated using infrared absorption spectroscopy and by electrical measurement of the defects present at the Si/Sio2 interface. We found in particular after rapid thermal annealing an important densification of the layers as a function of temperature and a reduction of the interfacial state densities which are comparable to classical thermal oxides.

Effects of Thermal Donor Generation and Annihilation Upon Oxygen Precipitation

1985 ◽  
Vol 59 ◽  
Author(s):  
S. Hahn ◽  
S. C. Shatas ◽  
H. J. Stein
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
High Carbon ◽  
High Carbon Content ◽  
Furnace Annealing ◽  
Annealing Stage ◽  
Thermal Donor ◽  
Oxygen Precipitation ◽  
Oxygen Precipitate ◽  
Marked Dependence

ABSTRACTRapid thermal annealing and furnace annealing steps have been combined to investigate the effects of thermal donor generation and annihilation upon oxygen precipitation in low and high carbon content silicon wafers. Thermal donors were formed by furnace annealing at 450°C. Rapid thermal annealing was performed in 10 s periods at temperatures between 600° and 1000°C and was followed by two step furnace annealing at 700° and 950 °C. Rapid thermal annealing separates the annealing stage for thermal donor removal from that for removal of oxygen precipitate nuclei, and a marked dependence upon carbon is observed for nuclei stability under RTA. Implications of these observations for models of precipitate nuclei are considered.

Activation Mechanisms in Ion-Implanted GaAs

1988 ◽  
Vol 126 ◽  
Author(s):  
N. Morris ◽  
B. J. Sealy
Keyword(s):  
Electrical Properties ◽  
Electrical Activity ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Annealing Time ◽  
Electrical Activation ◽  
Annealing Stage ◽  
Activation Mechanisms ◽  
Ion Implanted

ABSTRACTRapid thermal annealing has been used to study the electrical activation mechanisms for magnesium and selenium implants in GaAs. By analysing the changes in electrical activity as a function of annealing time and temperature, a model has been developed which accurately predicts the electrical properties following the post-implant annealing stage. The model has been used to study the activation of other ions, particularly zinc, beryllium, tin and sulphur, the results of which will be compared with those of magnesium and selenium. The results suggest that the mechanism for electrical activation is dominated by the diffusion of gallium, arsenic or vacancies. The paper will present the model and discuss the activation mechanisms of the ions.

Diffusion of Atoms Implanted in Poly Silicon Layer on Insulator

1987 ◽  
Vol 106 ◽  
Author(s):  
M. Takai ◽  
M. Izumi ◽  
T. Yamamoto ◽  
A. Kinomura ◽  
K. Gamo ◽  
...  
Keyword(s):  
Hall Effect ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Silicon Layer ◽  
Silicon On Insulator ◽  
Tail Region ◽  
Furnace Annealing ◽  
Peak Region ◽  
Poly Silicon ◽  
Hall Effect Measurements

ABSTRACTDiffusion of arsenic implanted in poly-silicon on insulator structures after furnace and rapid thermal annealing (RTA) has been investigated by Rutherford backscattering (RBS) and Hall effect measurements. The diffusivity for As in poly–Si on insulator is represented by D = 3.12 × 104 exp (− 3.86/kT) cm/sec for the tail region after both RTA and furnace annealing and D = 34.0 exp (− 3.42/kT) cm2/sec for the peak region after RTA. Poly–Si layers after implantation and annealing were found to have tensile stresses of 3.0 – 4.0 kbar.

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