Calibrations coefficients for determination of concentrations of vacancy-oxygen-related complexes and oxygen dimer in silicon by means of infrared absorption spectroscopy

Vacancy-oxygen complexes VnOm (n, m ≥ 1) in crystalline silicon are nucleation centers for oxygen precipitates, which are widely used as internal getters in modern technologies of production of silicon-based electronic devices and integrated circuits. For the controllable formation of oxygen precipitates in Si crystals in the technology processes the methods of determination of concentrations of the VnOm complexes are required. The aim of the present work was to find values of the calibration coefficients for determination of concentrations of the VnOm defects in Si from intensities of infrared (IR) absorption bands associated with the local vibrational modes (LVM) of these complexes. A combined electrical (Hall effect) and optical (IR absorption) study of vacancy-oxygen defects in identical silicon crystals irradiated with 6 MeV electrons was carried out. Based on the analysis of the data obtained, the values of the calibration coefficient for the determination of concentration of the vacancy-oxygen (VO) complex in silicon by the infrared absorption method were established: for measurements at room temperature (RT) – NVO = 8.5 · 1016 · αVO-RT cm–3, in the case of low-temperature (LT, Т ≡ 10 K) measurements – NVO = 3.5 · 1016 · αVO-LT cm–3, where αVO-RT(LT) are absorption coefficients in maxima of the LVM bands due to the VO complex in the spectra measured at corresponding temperatures. Calibration coefficients for the determination of concentrations of other VnOm (VO2, VO3, VO4, V2O and V3O) complexes and the oxygen dimer (O2) from an analysis of infrared absorption spectra measured at room temperature have been also determined.

Contactless transient carrier spectroscopy and imaging technique using lock-in free carrier emission and absorption

In this paper we present a contactless transient carrier spectroscopy and imaging technique for traps in silicon. At each pixel, we fit the transient decay of the trap emission which allows us to obtain both the trap time constant and trap concentration. Here we show that this technique allows for high-resolution images. Furthermore, this technique also allows to discriminate between the presence of thermal donors or oxygen precipitates in as-grown wafers, without requiring a thermal donor killing step.