scholarly journals Monolayer-level controlled incorporation of nitrogen in ultrathin gate dielectrics using remote plasma processing: Formation of stacked “N–O–N” gate dielectrics

Author(s):  
H. Niimi ◽  
G. Lucovsky
1999 ◽  
Vol 592 ◽  
Author(s):  
Gerry Lucovsky ◽  
Yider Wu ◽  
Yi-Mu Lee ◽  
Hanyang Yang ◽  
Hiro Niimi

ABSTRACTDirect tunneling limits aggressive scaling of thermally-grown oxides to about 1.6 nm, a thickness at which the tunneling current. Jg, at one volt is ∼1 A/cm2. This paper presents results that demonstrate that stacked gate dielectrics prepared by remote plasma processing that include i) ultra-thin nitrided SiO2 interfacial layers, and ii) either silicon nitride or oxynitride bulk dielectrics can extend the equivalent oxide thickness, EOT, to 1.1-1.0 nm before Jg, > 1 A/cm2.


2015 ◽  
Vol 13 (1) ◽  
pp. 147-160 ◽  
Author(s):  
Maria M. Giangregorio ◽  
Giuseppe V. Bianco ◽  
Pio Capezzuto ◽  
Giovanni Bruno ◽  
Maria Losurdo

1998 ◽  
Vol 83 (12) ◽  
pp. 7635-7639 ◽  
Author(s):  
Bradley C. Smith ◽  
H. Henry Lamb

2006 ◽  
Vol 9 (6) ◽  
pp. G211 ◽  
Author(s):  
Hyunseok Kang ◽  
Seokhoon Kim ◽  
Jihoon Choi ◽  
Jinwoo Kim ◽  
Hyeongtag Jeon ◽  
...  

2005 ◽  
Vol 23 (4) ◽  
pp. 911-916 ◽  
Author(s):  
S. C. Kang ◽  
J. Y. Hwang ◽  
N.-E. Lee ◽  
K. S. Joo ◽  
G. H. Bae

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