The Reliability and the Effect of NCA Trapping in Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 µm Pitch Cu Pillar Bumps and Low Temperature Curable Non-Conductive Adhesive (NCA)

2018 ◽  
Author(s):  
Jae-Yong Park ◽  
Hwan-Pil Park ◽  
Seongchul Kim ◽  
Taeyoung Lee ◽  
Young-Ho Kim ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Solder Joints ◽  
Conductive Adhesive ◽  
Cu Pillar

Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

2008 ◽  
Author(s):  
Yi-Shao Lai ◽  
Ying-Ta Chiu ◽  
Chiu-Wen Lee ◽  
Yu-Hsiu Shao ◽  
Jiunn Chen
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Cu Pillar

scholarly journals Electro-migration Behavior in Eutectic Sn-Bi Flip Chip Solder Joints with Cu-Pillar Electrodes

2013 ◽  
Vol 2 (4) ◽  
pp. 178-185 ◽  
Author(s):  
Kei MURAYAMA ◽  
Takashi KURIHARA ◽  
Taiji SAKAI ◽  
Nobuhiro IMAIZUMI ◽  
Kozo SHIMIZU ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Migration Behavior ◽  
Cu Pillar

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

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