Thermal Stress Analysis Of A Flip-Chip Parallel VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (48Sn-52In) Solder Joints

2006 ◽  
Author(s):  
J. Lau ◽  
W. Dauksher
Keyword(s):  
Thermal Stress ◽  
Low Temperature ◽  
Stress Analysis ◽  
Flip Chip ◽  
Solder Joints ◽  
Lead Free ◽  
Cavity Surface ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity

Flip-chip bonded 0.85-um Vertical-cavity Surface-emitting Laser Array using an AlGaAs substrate

1996 ◽  
Author(s):  
Yoshitaka Ohiso ◽  
Kouta Tateno ◽  
Yoshitaka Kohama ◽  
Hideki Tsunetsugu ◽  
Takashi Kurokawa
Keyword(s):  
Flip Chip ◽  
Cavity Surface ◽  
Laser Array ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity
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