2008 58th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

363
(FIVE YEARS 0)

H-INDEX

22
(FIVE YEARS 0)

Published By IEEE

9781424422302
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

scholarly journals 3D packaging architecture using paper as a dielectric medium

2008 ◽  
Author(s):  
Amin Rida ◽  
Li Yang ◽  
Napol Chaisilwattana ◽  
Scott Travis ◽  
Swapan Bhattacharya ◽  
...  
Keyword(s):  
Dielectric Medium ◽  
3D Packaging

Waferbond technologies and quality assessment

2008 ◽  
Author(s):  
Maik Wiemer ◽  
Jorg Fromel ◽  
Chenping Jia ◽  
Marco Haubold ◽  
Thomas Gessner
Keyword(s):  
Quality Assessment

Pluggable sockets for point-of-load converters in distributed power systems

2008 ◽  
Author(s):  
Phillip Henson ◽  
Josh Connell ◽  
R. Wayne Johnson ◽  
Mark Nelms ◽  
Prashant Joshi ◽  
...  
Keyword(s):  
Power Systems ◽  
Distributed Power ◽  
Distributed Power Systems

A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

2008 ◽  
Author(s):  
Liling Yan ◽  
Chengkuo Lee ◽  
Daquan Yu ◽  
Won Kyoung Choi ◽  
Aibin Yu ◽  
...  
Keyword(s):  
Low Temperature

Noise induced jitter in differential signaling

2008 ◽  
Author(s):  
Janani Chandrasekhar ◽  
Ege Engin ◽  
Madhavan Swaminathan ◽  
Kazuhide Uriu ◽  
Toru Yamada
Keyword(s):  
Differential Signaling
Load More ...
Sign in / Sign up

Export Citation Format

Share Document