2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

373

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538649992

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Fork Type Structure of Silicon Waveguide for Optical Efficiency Optimization

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00314 ◽

2018 ◽

Author(s):

Warren Wang ◽

Onion Z.Y. Yang ◽

Shian Tu ◽

Meiju Lu ◽

Jihan Chen ◽

...

Keyword(s):

Type Structure ◽

Optical Efficiency ◽

Efficiency Optimization ◽

Silicon Waveguide

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Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00145 ◽

2018 ◽

Author(s):

Thaer M. Alghoul ◽

Manu Yadav ◽

Sanoop Thekkut ◽

Rajesh S. Sivasubramony ◽

Christopher M. Greene ◽

...

Keyword(s):

Low Temperature

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Deep Understanding the role of Cu in RDL to Warpage by Exploring the Warpage Evolution with Microstructural Changes

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00364 ◽

2018 ◽

Cited By ~ 1

Author(s):

Gong Cheng ◽

Gaowei Xu ◽

Wei Gai ◽

Le Luo

Keyword(s):

Deep Understanding ◽

Microstructural Changes

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Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00273 ◽

2018 ◽

Cited By ~ 6

Author(s):

Chia-Hsin Lee ◽

Jay Su ◽

Xiao Liu ◽

Qi Wu ◽

Jim-Wein Lin ◽

...

Keyword(s):

Wafer Level ◽

Release Process ◽

Throughput Enhancement ◽

Wafer Level Packaging

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Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00238 ◽

2018 ◽

Cited By ~ 3

Author(s):

Kwang-Seong Choi ◽

Wagno Alves Braganca Junior ◽

leeseul Jeong ◽

Keon-Soo Jang ◽

Seok Hwan Moon ◽

...

Keyword(s):

Led Array ◽

Pet Substrate

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Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00183 ◽

2018 ◽

Cited By ~ 1

Author(s):

Zhaohui Chen ◽

Boon Long Lau ◽

Zhipeng Ding ◽

Eva Leong Ching Wai ◽

Beibei Han ◽

...

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A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00026 ◽

2018 ◽

Cited By ~ 2

Author(s):

B. Goubault ◽

G. Aspar ◽

J.-C. Souriau ◽

L. Castagne ◽

G. Simon ◽

...

Keyword(s):

3D Printing ◽

Encapsulation Process ◽

Microsystem Packaging

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A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00342 ◽

2018 ◽

Author(s):

Robert Klengel ◽

Sandy Klengel ◽

Georg Schusser ◽

Michael Krause

Keyword(s):

Efficient Method ◽

Integrated Systems ◽

Laser Techniques

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Analog Power Filtering: Modeling, Measuring & Analog PI

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00253 ◽

2018 ◽

Author(s):

Layne Berge ◽

Matt Doyle ◽

Kyle Schoneck

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Cost-Efficient Formation of Flexible Pressure Sensor with Micropillar Arrays by Metal-Assisted Chemical Etching for Wearable Electronic Skin

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00122 ◽

2018 ◽

Author(s):

Yougen Hu ◽

Xinyu Zhang ◽

Pengli Zhu ◽

Tao Zhao ◽

Yuan Zhang ◽

...

Keyword(s):

Pressure Sensor ◽

Chemical Etching ◽

Electronic Skin ◽

Wearable Electronic ◽

Metal Assisted Chemical Etching ◽

Cost Efficient ◽

Flexible Pressure Sensor ◽

Micropillar Arrays

Download Full-text

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fork Type Structure of Silicon Waveguide for Optical Efficiency Optimization

Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor

Deep Understanding the role of Cu in RDL to Warpage by Exploring the Warpage Evolution with Microstructural Changes

Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging

Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques

Analog Power Filtering: Modeling, Measuring & Analog PI

Cost-Efficient Formation of Flexible Pressure Sensor with Micropillar Arrays by Metal-Assisted Chemical Etching for Wearable Electronic Skin

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Latest Publications