4th Electronics Packaging Technology Conference, 2002.
Latest Publications

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(FIVE YEARS 0)

H-INDEX

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Published By IEEE

0780374355

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

RFICs packages electrical performance comparison of both ULTRA-CSP and Standard TSOP

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185591 ◽

2003 ◽

Cited By ~ 1

Author(s):

T. Hsu ◽

K. Chiang ◽

Yu-Po Wang

Keyword(s):

Performance Comparison ◽

Electrical Performance

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An adaptable compact thermal model for BGA packages

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185688 ◽

2003 ◽

Author(s):

Ming Xie ◽

Kok Chuan Toh ◽

D. Pinjala

Keyword(s):

Thermal Model ◽

Bga Packages

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Three dimensional finite element simulation of wire looping process in wirebonding

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185693 ◽

2003 ◽

Cited By ~ 6

Author(s):

B.H. Ng ◽

A.A.O. Tay ◽

S.H. Ong

Keyword(s):

Finite Element ◽

Finite Element Simulation ◽

Three Dimensional ◽

Element Simulation ◽

Dimensional Finite Element ◽

Three Dimensional Finite Element

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Solder imprint technology: A reverse growth of intermetallic compound at the interface to fix the brittle interfacial fracture of BGA package soldered on Ni/Au plating

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185595 ◽

2003 ◽

Author(s):

C.K. Chung ◽

K.F. Leong ◽

K.S. Sim

Keyword(s):

Intermetallic Compound ◽

Interfacial Fracture ◽

Bga Package

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Predicting optimal process conditions for flip-chip assembly using copper column bumped dies

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185694 ◽

2003 ◽

Cited By ~ 7

Author(s):

H. Lu ◽

C. Bailey

Keyword(s):

Flip Chip ◽

Process Conditions ◽

Optimal Process ◽

Flip Chip Assembly ◽

Copper Column

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Thermal methodology for evaluating the performance of microelectronic devices with non-uniform power dissipation

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185689 ◽

2003 ◽

Cited By ~ 2

Author(s):

Teck Joo Goh

Keyword(s):

Power Dissipation ◽

Microelectronic Devices

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Yield estimation for BGA assembly

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185669 ◽

2003 ◽

Author(s):

S.S. Phadnis ◽

K. Srihari ◽

V. Yamunan

Keyword(s):

Yield Estimation

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Over GHz frequency model of commercial 2mm hard metric connector using on-board calibration standards

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185666 ◽

2003 ◽

Cited By ~ 1

Author(s):

Seungyong Baek ◽

Bong Cheol Park ◽

Dong Gun Kam ◽

Joungho Kim

Keyword(s):

Frequency Model ◽

Calibration Standards

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In-situ reliability analysis of solder joint by digital image correlation

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185608 ◽

2003 ◽

Author(s):

J.H.L. Pang ◽

X.K. Zhang ◽

Q.J. Liu ◽

F.X. Che ◽

T.H. Low ◽

...

Keyword(s):

Digital Image Correlation ◽

Solder Joint ◽

Reliability Analysis ◽

Digital Image ◽

Image Correlation

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Flip chip interfacial behavior under thermal testing

4th Electronics Packaging Technology Conference, 2002. ◽

10.1109/eptc.2002.1185597 ◽

2003 ◽

Cited By ~ 5

Author(s):

Z.W. Zhong ◽

X.Q. Shi ◽

K.W. Wong ◽

Z.P. Wang

Keyword(s):

Flip Chip ◽

Thermal Testing ◽

Interfacial Behavior

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4th Electronics Packaging Technology Conference, 2002.Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

RFICs packages electrical performance comparison of both ULTRA-CSP and Standard TSOP

An adaptable compact thermal model for BGA packages

Three dimensional finite element simulation of wire looping process in wirebonding

Solder imprint technology: A reverse growth of intermetallic compound at the interface to fix the brittle interfacial fracture of BGA package soldered on Ni/Au plating

Predicting optimal process conditions for flip-chip assembly using copper column bumped dies

Thermal methodology for evaluating the performance of microelectronic devices with non-uniform power dissipation

Yield estimation for BGA assembly

Over GHz frequency model of commercial 2mm hard metric connector using on-board calibration standards

In-situ reliability analysis of solder joint by digital image correlation

Flip chip interfacial behavior under thermal testing

4th Electronics Packaging Technology Conference, 2002.
Latest Publications