Low temperature flip-chip process using ICA and NCA (isotropically and non-conductive adhesive) for flexible displays application

2003 ◽  
Author(s):  
J. Vanfleteren ◽  
B. Vandecasteele ◽  
T. Podprocky
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Conductive Adhesive ◽  
Flexible Displays

scholarly journals Fabrication and Packaging of CMUT Using Low Temperature Co-Fired Ceramic

Micromachines ◽  
2018 ◽  
Vol 9 (11) ◽  
pp. 553 ◽  
Author(s):  
Fikret Yildiz ◽  
Tadao Matsunaga ◽  
Yoichi Haga
Keyword(s):  
Low Temperature ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Ultrasonic Transducer ◽  
Silicon On Insulator ◽  
Anodic Bonding ◽  
Lateral Side ◽  
Membrane Thickness ◽  
Bonding Performance ◽  
Complex Admittance

This paper presents fabrication and packaging of a capacitive micromachined ultrasonic transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC). Anodic bonding of LTCC with Au vias-silicon on insulator (SOI) has been used to fabricate CMUTs with different membrane radii, 24 µm, 25 µm, 36 µm, 40 µm and 60 µm. Bottom electrodes were directly patterned on remained vias after wet etching of LTCC vias. CMUT cavities and Au bumps were micromachined on the Si part of the SOI wafer. This high conductive Si was also used as top electrode. Electrical connections between the top and bottom of the CMUT were achieved by Au-Au bonding of wet etched LTCC vias and bumps during anodic bonding. Three key parameters, infrared images, complex admittance plots, and static membrane displacement, were used to evaluate bonding success. CMUTs with a membrane thickness of 2.6 µm were fabricated for experimental analyses. A novel CMUT-IC packaging process has been described following the fabrication process. This process enables indirect packaging of the CMUT and integrated circuit (IC) using a lateral side via of LTCC. Lateral side vias were obtained by micromachining of fabricated CMUTs and used to drive CMUTs elements. Connection electrodes are patterned on LTCC side via and a catheter was assembled at the backside of the CMUT. The IC was mounted on the bonding pad on the catheter by a flip-chip bonding process. Bonding performance was evaluated by measurement of bond resistance between pads on the IC and catheter. This study demonstrates that the LTCC and LTCC side vias scheme can be a potential approach for high density CMUT array fabrication and indirect integration of CMUT-IC for miniature size packaging, which eliminates problems related with direct integration.

Ultra-low temperature curable nano-silver conductive adhesive for piezoelectric composite material

2018 ◽  
Vol 529 ◽  
pp. 9-15 ◽  
Author(s):  
Chao Yan ◽  
Qingwei Liao ◽  
Xingli Zhou ◽  
Likun Wang ◽  
Chao Zhong ◽  
...  
Keyword(s):  
Composite Material ◽  
Low Temperature ◽  
Conductive Adhesive ◽  
Piezoelectric Composite ◽  
Nano Silver

Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive Polymers

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 1-24
Author(s):  
Michael Gallagher ◽  
Jong-Uk Kim ◽  
Eric Huenger ◽  
Kai Zoschke ◽  
Christina Lopper ◽  
...  
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Flip Chip ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Curing Temperature ◽  
Wafer Level ◽  
Mechanical Adhesion ◽  
3D Stacking ◽  
Dry Etch

3D stacking, one of the 3D integration technologies using through silicon vias (TSVs), is considered as a desirable 3D solution due to its cost effectiveness and matured technical background. For successful 3D stacking, precisely controlled bonding of the two substrates is necessary, so that various methods and materials have been developed over the last decade. Wafer bonding using polymeric adhesives has advantages. Surface roughness, which is critical in direct bonding and metal-to-metal bonding, is not a significant issue, as the organic adhesive can smooth out the unevenness during bonding process. Moreover, bonding of good quality can be obtained using relatively low bonding pressure and low bonding temperature. Benzocyclobutene (BCB) polymers have been commonly used as bonding adhesives due to their relatively low curing temperature (~250 °C), very low water uptake (<0.2%), excellent planarizing capability, and good affinity to Cu metal lines. In this study, we present wafer bonding with BCB at various conditions. In particular, bonding experiments are performed at low temperature range (180 °C ~ 210 °C), which results in partially cured state. In order to examine the effectiveness of the low temperature process, the mechanical (adhesion) strength and dimensional changes are measured after bonding, and compared with the values of the fully cured state. Two different BCB polymers, dry-etch type and photo type, are examined. Dry etch BCB is proper for full-area bonding, as it has low degree of cure and therefore less viscosity. Photo-BCB has advantages when a pattern (frame or via open) is to be structured on the film, since it is photoimageable (negative tone), and its moderate viscosity enables the film to sustain the patterns during the wafer bonding process. The effect of edge beads at the wafer rim area and the soft cure (before bonding) conditions on the bonding quality are also studied. Alan/Rey ok move from Flip Chip and Wafer Level Packaging 1-6-12.

Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

2012 ◽  
Author(s):  
Akiko Okada ◽  
Masatsugu Nimura ◽  
Naoko Unami ◽  
Akitsu Shigetou ◽  
Hirokazu Noma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
3D Integration ◽  
Flip Chip Bonding

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

2002 ◽  
Author(s):  
Muthiah Venkateswaran ◽  
Peter Borgesen ◽  
K. Srihari
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Critical Evaluation ◽  
Conductive Adhesive ◽  
Circuit Board ◽  
Lead Free ◽  
Conductive Adhesives ◽  
Flip Chip Assembly ◽  
Placement Machine

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.

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