Testable Design for Electrical Testing of Open Defects at Interconnects in 3D ICs

2013 ◽  
Author(s):  
Masaki Hashizume ◽  
Tomoaki Konishi ◽  
Hiroyuki Yotsuyanag ◽  
Shyue-Kung Lu
Keyword(s):  
3D Ics ◽  
Open Defects ◽  
Testable Design

Testability for resistive open defects by electrical interconnect test of 3D ICs without boundary scan flip flops

2016 ◽  
Author(s):  
Fara Ashikin Binti Ali ◽  
Masaki Hashizume ◽  
Yuki Ikiri ◽  
Hiroyuki Yotsuyanagi ◽  
Shyue-Kung Lu
Keyword(s):  
Boundary Scan ◽  
3D Ics ◽  
Interconnect Test ◽  
Open Defects ◽  
Resistive Open Defects

scholarly journals Electrical Test Method for Interconnect Open Defects in 3D ICs

2012 ◽  
Vol 5 (1) ◽  
pp. 26-33 ◽  
Author(s):  
Tomoaki Konishi ◽  
Hiroyuki Yotsuyanagi ◽  
Masaki Hashizume
Keyword(s):  
Test Method ◽  
Electrical Test ◽  
3D Ics ◽  
Open Defects

A testable design for electrical interconnect tests of 3D ICs

2015 ◽  
Author(s):  
Akihiro Odoriba ◽  
Shoichi Umezu ◽  
Masaki Hashizume ◽  
Hiroyuki Yotsuyanagi ◽  
Fara Ashikin Binti Ali ◽  
...  
Keyword(s):  
3D Ics ◽  
Testable Design

Resistive open defects detected by interconnect testing based on charge volume injected to 3D ICs

2017 ◽  
Author(s):  
Kouhei Ohtani ◽  
Naho Osato ◽  
Masaki Hashizume ◽  
Hiroyuki Yotsuyanagi ◽  
Shyue-Kung Lu
Keyword(s):  
Interconnect Testing ◽  
3D Ics ◽  
Open Defects ◽  
Resistive Open Defects
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