Effect of current crowding on whisker growth at the anode in flip chip solder joints

2007 ◽  
Vol 91 (23) ◽  
pp. 231919 ◽  
Author(s):  
Fan-Yi Ouyang ◽  
Kai Chen ◽  
K. N. Tu ◽  
Yi-Shao Lai
Keyword(s):  
Flip Chip ◽  
Whisker Growth ◽  
Solder Joints ◽  
Current Crowding

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

2009 ◽  
Vol 38 (12) ◽  
pp. 2443-2448 ◽  
Author(s):  
S. W. Liang ◽  
Hsiang-Yao Hsiao ◽  
Chih Chen ◽  
Luhua Xu ◽  
K. N. Tu ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Negative Marker

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

2012 ◽  
Vol 111 (4) ◽  
pp. 043705 ◽  
Author(s):  
Y. C. Liang ◽  
W. A. Tsao ◽  
Chih Chen ◽  
Da-Jeng Yao ◽  
Annie T. Huang ◽  
...  
Keyword(s):  
Joule Heating ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Heating Effects

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

2006 ◽  
Vol 88 (1) ◽  
pp. 012106 ◽  
Author(s):  
Lingyun Zhang ◽  
Shengquan Ou ◽  
Joanne Huang ◽  
K. N. Tu ◽  
Stephen Gee ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Void Propagation

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

2008 ◽  
Vol 23 (9) ◽  
pp. 2333-2339 ◽  
Author(s):  
D. Yang ◽  
Y.C. Chan ◽  
B.Y. Wu ◽  
M. Pecht
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
High Current Density ◽  
Dominant Role ◽  
Current Crowding ◽  
Wind Force ◽  
Cross Sectional ◽  
Ambient Temperatures ◽  
Atomic Flux ◽  
Electron Wind

The electromigration and thermomigration behavior of eutectic tin-lead flip chip solder joints, subjected to currents ranging from 1.6 to 2.0 A, at ambient temperatures above 100 °C, was experimentally and numerically studied. The temperature at the chip side was monitored using both a temperature coefficient of resistance method and a thermal infrared technique. The electron wind force and thermal gradient played the dominant role in accelerated atomic migration. The atomic flux of lead due to electromigration and thermomigration was estimated for comparison. At the current crowding region, electromigration induced a more serious void accumulation as compared with thermomigration. Also, because of different thermal dissipations, a morphological variation was detected at different cross-sectional planes of the solder joint during thermomigration.

Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

2005 ◽  
Vol 475-479 ◽  
pp. 2655-2658 ◽  
Author(s):  
Y.H. Lin ◽  
C.M. Tsai ◽  
Y.C. Hu ◽  
Y.L. Lin ◽  
J.Y. Tsai ◽  
...  
Keyword(s):  
Mass Transport ◽  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
Critical Role ◽  
Current Crowding ◽  
Metal Dissolution ◽  
Cu Metallization

The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed.

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