Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
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2009 ◽
Vol 38
(12)
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pp. 2443-2448
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2007 ◽
Vol 12
(5)
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pp. 423-430
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2017 ◽
Vol 51
(3)
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pp. 035103
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