Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

S. W. Liang; Chih Chen; J. K. Han; Luhua Xu; K. N. Tu; Yi-Shao Lai

doi:10.1063/1.3410796

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Journal of Applied Physics ◽

10.1063/1.3410796 ◽

2010 ◽

Vol 107 (9) ◽

pp. 093715 ◽

Cited By ~ 10

Author(s):

S. W. Liang ◽

Chih Chen ◽

J. K. Han ◽

Luhua Xu ◽

K. N. Tu ◽

...

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Whisker Growth ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints

Journal of Materials Research ◽

10.1557/jmr.2012.22 ◽

2012 ◽

Vol 27 (8) ◽

pp. 1169-1177 ◽

Cited By ~ 8

Author(s):

Hsiao-Yun Chen ◽

Chih Chen

Keyword(s):

Intermetallic Compound ◽

Kinetic Study ◽

Flip Chip ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation ◽

Image Position

Abstract

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Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering

Journal of Electronic Materials ◽

10.1007/s11664-005-0163-9 ◽

2005 ◽

Vol 34 (12) ◽

pp. 1543-1549 ◽

Cited By ~ 30

Author(s):

Kai-Zheng Wang ◽

Chih-Ming Chen

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Flip Chip ◽

Morphology Evolution ◽

Under Bump Metallization ◽

Compound Formation ◽

Reflow Soldering ◽

Intermetallic Compound Formation

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Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

Journal of Electronic Materials ◽

10.1007/bf02692545 ◽

2006 ◽

Vol 35 (5) ◽

pp. 897-904 ◽

Cited By ~ 13

Author(s):

Yanghua Xia ◽

Chuanyan Lu ◽

Junling Chang ◽

Xiaoming Xie

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707608 ◽

2006 ◽

Author(s):

Peng Sun ◽

C. Andersson ◽

Xicheng Wei ◽

Zhaonian Cheng ◽

Dongkai Shangguan ◽

...

Keyword(s):

Intermetallic Compound ◽

Surface Finish ◽

Solder Joints ◽

Compound Formation ◽

Reflow Soldering ◽

Intermetallic Compound Formation ◽

Electroless Ni

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Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging

Soldering & Surface Mount Technology ◽

10.1108/09540910610665099 ◽

2006 ◽

Vol 18 (2) ◽

pp. 18-26 ◽

Cited By ~ 2

Author(s):

Li‐Yin Hsiao ◽

Jenq‐Gong Duh

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Diffusion Path ◽

Compound Formation ◽

Solder Bumps ◽

Intermetallic Compound Formation ◽

And Diffusion

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Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.46.1295 ◽

2005 ◽

Vol 46 (6) ◽

pp. 1295-1300 ◽

Cited By ~ 8

Author(s):

Dae-Gon Kim ◽

Seung-Boo Jung

Keyword(s):

Intermetallic Compound ◽

Growth Kinetics ◽

Flip Chip ◽

Compound Formation ◽

Intermetallic Compound Formation

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Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after Aging

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ◽

10.1109/hdp.2005.251393 ◽

2005 ◽

Author(s):

Li-yin Hsiao ◽

Jenq-gong Duh

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Solder Bump ◽

Diffusion Path ◽

Compound Formation ◽

Intermetallic Compound Formation ◽

And Diffusion

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Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

Journal of Electronic Materials ◽

10.1007/s11664-004-0134-6 ◽

2004 ◽

Vol 33 (4) ◽

pp. 283-289 ◽

Cited By ~ 18

Author(s):

Chien-Sheng Huang ◽

Guh-Yaw Jang ◽

Jenq-Gong Duh

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Under Bump Metallization ◽

Compound Formation ◽

Solder Bumps ◽

Intermetallic Compound Formation

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Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb–xCu solder joints

Science and Technology of Welding & Joining ◽

10.1179/174329308x277737 ◽

2008 ◽

Vol 13 (8) ◽

pp. 781-790 ◽

Cited By ~ 2

Author(s):

H. T. Lee ◽

W. Y. Huang ◽

Y. F. Chen

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

Journal of Electronic Materials ◽

10.1007/s11664-020-08514-y ◽

2020 ◽

Vol 50 (1) ◽

pp. 233-248

Author(s):

Md. Tusher Ahmed ◽

Mohammad Motalab ◽

Jeffrey C. Suhling

Keyword(s):

Mechanical Property ◽

Intermetallic Compound ◽

Solder Joint ◽

Flip Chip ◽

Compound Formation ◽

Intermetallic Compound Formation

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