The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 104 A/cm2 at 125 °C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu6Sn5 exhibited preferred orientation related to the electric current direction.

Electrically Assisted Wire Drawing Polarity Effects

Electrically assisted manufacturing is the direct application of an electric current or field to a workpiece during a manufacturing operation. In addition to resistive heating, various anomalous effects have been observed experimentally. Since its conception in the 1950s, scientists continue to debate the existence of these so called electroplastic effects (EPEs) due to conflicted results shown throughout literature. A popular theory of electroplasticity is the electron wind, which postulates that there is a transfer of momentum between electrons and dislocations, which assists their motion during deformation. Though refuted both mathematically and experimentally in other types of tests, the electron wind theory, and therefore the existence of electroplasticity, is interestingly supported by the existence of polarity effects in wire drawing. A detailed review of the literature that has shown polarity effects in wire drawing is conducted. While the authors of these publications failed to fully disclose all test parameters, requiring several assumptions to be made, it appears that no mathematical/logical trends could be established. It is hypothesized herein that the velocity of the wire in a wire drawing application can influence the drift velocity of electrons, thereby increasing or decreasing current flow explicitly through the moving section of the wire. In order to test this hypothesis, a fixture was constructed which is capable of passing a current through a moving wire at common wire drawing speeds. Modern sensing equipment was used to measure various electrical parameters during testing. The wire speed effect hypothesis was refuted by experimental testing. While the results of experimental testing thus far indicate the existence of electroplasticity, further testing that includes drawing and force measurements must be conducted in order to fully conclude its existence in the wire drawing application.

Excellent Ductility in the Extruded AZ61 Magnesium Alloy Tube Induced by Electropulsing Treatment during Tension

In this work, we reported the high ductility of an extruded AZ61 magnesium alloy tube achieved by electropulsing current-assisted tension. The elongation of the alloy reached up to about 45%, which is largely superior to the majority of AZ61 wrought Mg alloys. We found that the hardening capacity of the alloy seemed to slightly increase as the electropulsing frequency increased. Furthermore, electropulsing can arouse the serrated flow phenomenon. Here we proposed an equation describing the correlation between the average amplitude and frequency: Aa = C − 6 × 10−3f, where Aa is the average amplitude, f is the frequency, and C is the constant. In addition, introducing electropulsing current pronouncedly reduced the tendency of twinning, but the twinning fraction seemed to fail depending on the electropulsing frequency. Based on microstructure analysis, we concluded that the outstanding ductility of the studied alloy was mainly due to the combined role of the thermal effects from Joule heating, the athermal effects from electron wind, and the magnetic effects from the electropulsing current. The serrated flow phenomenon occurred along stress–strain curves after electropulsing treatment, and the underlying reasons also were uncovered.

Formation mechanism of Cu/Cu3Sn–Cu/Cu interconnections based on solder-filled microporous copper as interlayer via a current-assisted thermal compression bonding

In this study, a Cu/Cu3Sn–Cu/Cu interconnection can be achieved based on solder-filled microporous copper (MPC) as interlayer via a current-assisted thermal compression bonding. The high-temperature soldering connection materials can be used in the third-generation semiconductor packaging, so as to meet the promising application in high-temperature power device packaging. The influence of auxiliary current on the microstructure evolution of Cu–Sn IMCs and its formation mechanism were studied. Experiments show that the action of Joule heat coupled with the electron wind significantly enhanced the interfacial reaction at the Cu/Sn metallization interface. The microstructure of Cu6Sn5 changed from scallop-like into columnar due to constitutional supercooling, and the dispersion distribution of Cu6Sn5 also changed. The growth constitutive equations of Cu3Sn in bondlines were established under current-assisted thermal compression bonding process.

Static Recrystallization Microstructure Evolution in a Cold-Deformed Ni-Based Superalloy during Electropulsing Treatment

The influence of electropulsing treatment (EPT) parameters on the static recrystallization (SRX) microstructure in a cold-deformed Ni-based superalloy was investigated. During EPT, both the volume fraction of SRX grains and the average grain size increased with the increasing EPT temperature, which was attributed to the thermal effect and athermal effect induced by EPT. The mobility of SRX grain boundaries was promoted at the higher temperature due to the thermal effect, while the nucleation rate would be increased by EPT through decreasing the thermodynamic barrier. The formation of parallel dislocations caused by electron wind force could also play an indirect role in promoting SRX process. Moreover, the volume fraction of SRX grains increased significantly with the extension of EPT time at 700 °C, while the EPT time had a trivial effect on the average grain size. In addition, the sufficient deformation was essential to the occurrence of SRX behavior during EPT, and the localized Joule heating effect could promote the SRX behavior in the samples with the larger strains. Besides that, the influence of twining and carbides on the SRX behaviors was also investigated.