Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature

2005 ◽  
Vol 98 (1) ◽  
pp. 013715 ◽  
Author(s):  
J. W. Nah ◽  
J. O. Suh ◽  
K. N. Tu
Keyword(s):  
Joule Heating ◽  
Room Temperature ◽  
Flip Chip ◽  
Composite Solder ◽  
Solder Joints ◽  
Current Crowding

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

2012 ◽  
Vol 111 (4) ◽  
pp. 043705 ◽  
Author(s):  
Y. C. Liang ◽  
W. A. Tsao ◽  
Chih Chen ◽  
Da-Jeng Yao ◽  
Annie T. Huang ◽  
...  
Keyword(s):  
Joule Heating ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Heating Effects

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

2009 ◽  
Vol 38 (12) ◽  
pp. 2443-2448 ◽  
Author(s):  
S. W. Liang ◽  
Hsiang-Yao Hsiao ◽  
Chih Chen ◽  
Luhua Xu ◽  
K. N. Tu ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Negative Marker

Effects of Current Crowding and Joule Heating on Reliability of Solder Joints

2007 ◽  
Author(s):  
S. W. Liang ◽  
S. H. Chiu ◽  
Chih Chen ◽  
Shinichi Ogawa ◽  
Paul S. Ho ◽  
...  
Keyword(s):  
Joule Heating ◽  
Solder Joints ◽  
Current Crowding ◽  
Reliability Of Solder Joints

Effect of current crowding on whisker growth at the anode in flip chip solder joints

2007 ◽  
Vol 91 (23) ◽  
pp. 231919 ◽  
Author(s):  
Fan-Yi Ouyang ◽  
Kai Chen ◽  
K. N. Tu ◽  
Yi-Shao Lai
Keyword(s):  
Flip Chip ◽  
Whisker Growth ◽  
Solder Joints ◽  
Current Crowding

Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

2006 ◽  
Vol 88 (2) ◽  
pp. 022110 ◽  
Author(s):  
S. H. Chiu ◽  
T. L. Shao ◽  
Chih Chen ◽  
D. J. Yao ◽  
C. Y. Hsu
Keyword(s):  
Joule Heating ◽  
Hot Spots ◽  
Flip Chip ◽  
Solder Joints ◽  
Infrared Microscopy ◽  
Snag Solder

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

2006 ◽  
Vol 88 (1) ◽  
pp. 012106 ◽  
Author(s):  
Lingyun Zhang ◽  
Shengquan Ou ◽  
Joanne Huang ◽  
K. N. Tu ◽  
Stephen Gee ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Void Propagation
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