Influence of Cu columns on current crowding effect in electromigration in flip-chip solder joints

2011 ◽  
Author(s):  
Y. C. Liang ◽  
W. A. Tsao ◽  
Da-Jeng Yao ◽  
Yi-Shao Lai ◽  
Chih Chen
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Crowding Effect

Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 185-188 ◽  
Author(s):  
J.W. Jang ◽  
L.N. Ramanathan ◽  
J. Tang ◽  
D.R. Frear
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Crowding Effect ◽  
Secondary Current

scholarly journals Relieving the current crowding effect in flip-chip solder joints during current stressing

2006 ◽  
Vol 21 (1) ◽  
pp. 137-146 ◽  
Author(s):  
S.W. Liang ◽  
T.L. Shao ◽  
Chih Chen ◽  
Everett C.C. Yeh ◽  
K.N. Tu
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Solder Joints ◽  
Three Dimensional ◽  
Current Crowding ◽  
Crowding Effect ◽  
Average Temperature ◽  
Current Stressing ◽  
Underbump Metallization ◽  
Overall Resistance

Three-dimensional simulations for relieving the current crowding effect in solder joints under current stressing were carried out using the finite element method. Three possible approaches were examined in this study, including varying the size of the passivation opening, increasing the thickness of Cu underbump metallization (UBM), and adopting or inserting a thin highly resistive UBM layer. It was found that the current crowding effect in the solder bump could be successfully relieved with the thick Cu UBM or with the highly resistive UBM. Compared to the solder joint with Al/Ni(V)/Cu UBM, for instance, the maximum current density in a solder bump decreased dramatically by a factor of fifteen, say from 1.11 × 105 A/cm2 to 7.54 × 103 A/cm2 when a 20-μm-thick Cu UBM was used. It could be lowered by a factor of seven, say to 1.55 × 104 A/cm2, when a 0.7-μm UBM of 14770 μΩ cm was adopted. It is worth noting that although a resistive UBM layer was used, the penalty on overall resistance increase was negligible because the total resistance was dominated by the Al trace instead of the solder bump. Thermal simulation showed that the average temperature increase due to Joule heating effect was only 2.8 °C when the solder joints with UBM of 14770 μΩ cm were applied by 0.2 A.

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

2009 ◽  
Vol 38 (12) ◽  
pp. 2443-2448 ◽  
Author(s):  
S. W. Liang ◽  
Hsiang-Yao Hsiao ◽  
Chih Chen ◽  
Luhua Xu ◽  
K. N. Tu ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Negative Marker

Effect of current crowding on whisker growth at the anode in flip chip solder joints

2007 ◽  
Vol 91 (23) ◽  
pp. 231919 ◽  
Author(s):  
Fan-Yi Ouyang ◽  
Kai Chen ◽  
K. N. Tu ◽  
Yi-Shao Lai
Keyword(s):  
Flip Chip ◽  
Whisker Growth ◽  
Solder Joints ◽  
Current Crowding

Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints

2012 ◽  
Vol 111 (4) ◽  
pp. 043705 ◽  
Author(s):  
Y. C. Liang ◽  
W. A. Tsao ◽  
Chih Chen ◽  
Da-Jeng Yao ◽  
Annie T. Huang ◽  
...  
Keyword(s):  
Joule Heating ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Heating Effects

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

2006 ◽  
Vol 88 (1) ◽  
pp. 012106 ◽  
Author(s):  
Lingyun Zhang ◽  
Shengquan Ou ◽  
Joanne Huang ◽  
K. N. Tu ◽  
Stephen Gee ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Flip Chip ◽  
Solder Joints ◽  
Current Crowding ◽  
Void Propagation
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