Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

2004 IEEE International Reliability Physics Symposium. Proceedings ◽

10.1109/relphy.2004.1315327 ◽

2004 ◽

Cited By ~ 17

Author(s):

C.-K. Hu ◽

D. Canaperi ◽

S.T. Chen ◽

L.M. Gignac ◽

B. Herbst ◽

...

Keyword(s):

Reliability Improvement ◽

Low K

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Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure

2006 International Interconnect Technology Conference ◽

10.1109/iitc.2006.1648658 ◽

2006 ◽

Cited By ~ 4

Author(s):

A. Sakata ◽

M. Yamada ◽

M. Hasunuma ◽

S. Takahashi ◽

A. Yamada ◽

...

Keyword(s):

Reliability Improvement ◽

Barrier Metal ◽

Low K

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Reliability improvement of 9 nm-node Cu/low-k interconnects

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219771 ◽

2004 ◽

Cited By ~ 1

Author(s):

S. Matsumoto ◽

A. Ishii ◽

K. Tomita ◽

K. Hashimoto ◽

Y. Nishioka ◽

...

Keyword(s):

Reliability Improvement ◽

Low K

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Reliability Improvement in Multi-level Cu/SiOC Low k Integration

13th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2006.251009 ◽

2006 ◽

Cited By ~ 1

Author(s):

Y. W. Chen ◽

I.C. Chen ◽

Johnston Zou ◽

G. Zhang ◽

Steven Chen ◽

...

Keyword(s):

Reliability Improvement ◽

Multi Level ◽

Low K

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Reliability improvement of 90nm large flip chip low-k die via dicing and assembly process optimization

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342785 ◽

2006 ◽

Cited By ~ 4

Author(s):

Raghunandan Chaware ◽

Lan Hoang

Keyword(s):

Process Optimization ◽

Flip Chip ◽

Assembly Process ◽

Reliability Improvement ◽

Low K

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Reliability improvement of Cu/low-k interconnects by integrating novel single pass single wafer wet clean

ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005. ◽

10.1109/issm.2005.1513331 ◽

2005 ◽

Cited By ~ 2

Author(s):

R. Chang ◽

Jianshe Tang ◽

S. Verhaverbeke ◽

K. Smekalin ◽

J.T.C. Lee ◽

...

Keyword(s):

Single Pass ◽

Reliability Improvement ◽

Low K

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Reliability Improvement By Adopting Ti-barrier Metal For Porous Low-k ILD Structure

10.1063/1.2815787 ◽

2007 ◽

Cited By ~ 6

Author(s):

A. Sakata ◽

S. Yamashita ◽

S. Omoto ◽

M. Hatano ◽

J. Wada ◽

...

Keyword(s):

Reliability Improvement ◽

Barrier Metal ◽

Low K

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Low-k Reliability Improvement with Optimal Dummy Insertion

ECS Transactions ◽

10.1149/06001.0739ecst ◽

2014 ◽

Vol 60 (1) ◽

pp. 739-744

Author(s):

R. Ma ◽

X. Shi ◽

C. Xia ◽

X. Xu ◽

B. Ni ◽

...

Keyword(s):

Reliability Improvement ◽

Low K

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Reliability improvement of Cu/low-k dual damascene interconnects using the depo/etch barrier process by newly developed I-PVD

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014953 ◽

2003 ◽

Author(s):

K. Motoyama ◽

J. Faguet ◽

J. Katsuki ◽

G. Chung ◽

T. Tonegawa ◽

...

Keyword(s):

Reliability Improvement ◽

Dual Damascene ◽

Damascene Interconnects ◽

Low K

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A Comprehensive study of reliability improvement for 65nm Cu/Low-k process

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2009.5232554 ◽

2009 ◽

Cited By ~ 1

Author(s):

C. C. Liao ◽

Z. H. Gan ◽

Y. J. Wu ◽

K. Zheng ◽

R. Guo ◽

...

Keyword(s):

Reliability Improvement ◽

Low K ◽

Comprehensive Study

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Reliability Improvement for Stacked Dielectric with Low-k SiOCH Dielectric and SiCN Barrier by UV-Assisted Thermal Curing

ECS Journal of Solid State Science and Technology ◽

10.1149/2162-8777/abade7 ◽

2020 ◽

Vol 9 (7) ◽

pp. 073002

Author(s):

Yi-Lung Cheng ◽

Yu-Lu Lin ◽

Giin-Shan Chen ◽

Jau-Shiung Fang

Keyword(s):

Thermal Curing ◽

Reliability Improvement ◽

Low K

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