Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)

Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014872 ◽

2003 ◽

Cited By ~ 2

Author(s):

M. Tada ◽

Y. Harada ◽

K. Hijioka ◽

H. Ohtake ◽

T. Takeuchi ◽

...

Keyword(s):

Hard Mask ◽

Dual Damascene ◽

Etch Stop ◽

Damascene Interconnects

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Single wafer RapidCuring/spl trade/ of porous low-k materials

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014941 ◽

2003 ◽

Cited By ~ 4

Author(s):

C. Waldfried ◽

Qingyuan Han ◽

O. Escorcia ◽

A. Margolis ◽

R. Albano ◽

...

Keyword(s):

Low K

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Evaluation and analysis for mechanical strengths of low k dielectrics by a finite element method

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014891 ◽

2003 ◽

Cited By ~ 14

Author(s):

N. Aoi ◽

T. Fukuda ◽

H. Yanazawa

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Mechanical Strengths ◽

Low K ◽

Element Method

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Integration of electroless copper for seed repair

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014951 ◽

2003 ◽

Author(s):

C. Witt ◽

A. Frank ◽

E. Webb ◽

J. Reid ◽

K. Pfeifer

Keyword(s):

Electroless Copper

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Electromigration failure mechanism studies on copper interconnects

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014913 ◽

2003 ◽

Cited By ~ 15

Author(s):

A.H. Fischer ◽

A. von Glasow ◽

S. Penka ◽

F. Ungar

Keyword(s):

Failure Mechanism ◽

Copper Interconnects

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A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014893 ◽

2003 ◽

Cited By ~ 9

Author(s):

J.-Q. Lu ◽

Y. Kwon ◽

G. Rajagopalan ◽

M. Gupta ◽

J. McMahon ◽

...

Keyword(s):

3D Ic ◽

Technology Platform ◽

Wafer Scale ◽

Ic Technology

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Impact of dielectrics and metals properties on electrical performances of advanced on-chip interconnects

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014920 ◽

2003 ◽

Cited By ~ 3

Author(s):

C. Bermond ◽

B. Flechet ◽

A. Farcy ◽

V. Arnal ◽

J. Torres ◽

...

Keyword(s):

On Chip

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Integrated chip-scale simulation of pattern dependencies in copper electroplating and copper chemical mechanical polishing processes

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014922 ◽

2003 ◽

Cited By ~ 5

Author(s):

T.E. Tugbawa ◽

T.H. Park ◽

D.S. Boning

Keyword(s):

Chemical Mechanical Polishing ◽

Mechanical Polishing ◽

Copper Electroplating ◽

Pattern Dependencies

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Thermal stress of 140 nm-width Cu damascene interconnects

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014912 ◽

2003 ◽

Cited By ~ 5

Author(s):

N. Okada ◽

Y. Matsubara ◽

H. Kimura ◽

H. Aizawa ◽

N. Nakamura

Keyword(s):

Thermal Stress ◽

Damascene Interconnects

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Cross-sectional elastic imaging and defect detection in low-k spin-on dielectrics

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) ◽

10.1109/iitc.2002.1014945 ◽

2003 ◽

Cited By ~ 1

Author(s):

L. Muthuswami ◽

E.S. Moyer ◽

Z. Li ◽

R.E. Geer

Keyword(s):

Defect Detection ◽

Cross Sectional ◽

Low K

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Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Single wafer RapidCuring/spl trade/ of porous low-k materials

Evaluation and analysis for mechanical strengths of low k dielectrics by a finite element method

Integration of electroless copper for seed repair

Electromigration failure mechanism studies on copper interconnects

A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects

Impact of dielectrics and metals properties on electrical performances of advanced on-chip interconnects

Integrated chip-scale simulation of pattern dependencies in copper electroplating and copper chemical mechanical polishing processes

Thermal stress of 140 nm-width Cu damascene interconnects

Cross-sectional elastic imaging and defect detection in low-k spin-on dielectrics

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Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Single wafer RapidCuring/spl trade/ of porous low-k materials

Evaluation and analysis for mechanical strengths of low k dielectrics by a finite element method

Integration of electroless copper for seed repair

Electromigration failure mechanism studies on copper interconnects

A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects

Impact of dielectrics and metals properties on electrical performances of advanced on-chip interconnects

Integrated chip-scale simulation of pattern dependencies in copper electroplating and copper chemical mechanical polishing processes

Thermal stress of 140 nm-width Cu damascene interconnects

Cross-sectional elastic imaging and defect detection in low-k spin-on dielectrics

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
Latest Publications