2006 8th Electronics Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

151

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

1424406641

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

On the thermal stability margins of high-leakage current packaged devices

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342762 ◽

2006 ◽

Cited By ~ 2

Author(s):

Chang-chi Lee ◽

Johannes de Groot

Keyword(s):

Thermal Stability ◽

Leakage Current ◽

Stability Margins ◽

High Leakage Current

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High-frequency characterization of embedded active components in printed circuit boards

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342789 ◽

2006 ◽

Cited By ~ 1

Author(s):

Maarten Cauwe ◽

Johan De Baets ◽

Andre Van Calster

Keyword(s):

High Frequency ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Active Components ◽

Printed Circuit

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Shape matching-assisted self-assembly of microchips on a silicon substrate

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342682 ◽

2006 ◽

Cited By ~ 1

Author(s):

L.L. Yan ◽

Y.L. Lim ◽

Y.Y. Ong ◽

E.B. Liao ◽

V. Kripesh

Keyword(s):

Silicon Substrate ◽

Self Assembly ◽

Shape Matching

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Effects of metal surface finish on the anisotropic conductive adhesives (ACAs) joints

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342706 ◽

2006 ◽

Author(s):

Hyoung-joon Kim ◽

Kyung-wook Paik

Keyword(s):

Metal Surface ◽

Surface Finish ◽

Conductive Adhesives

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Exploring the ulthimo platform

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342780 ◽

2006 ◽

Author(s):

Marc de Samber ◽

Coen Tak ◽

Wil Peels

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Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342809 ◽

2006 ◽

Cited By ~ 4

Author(s):

L. Wang ◽

T. Zoumpoulidis ◽

M. Bartek ◽

A. Polyakov ◽

K.M.B. Jansen ◽

...

Keyword(s):

Mechanical Characterization

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Reliability analysis of sandwich microdisplay packaging using an integrated interferometry system

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342806 ◽

2006 ◽

Author(s):

Audrey C.Y. Wong ◽

Yaofeng Sun ◽

Sow Chorng ◽

Su Fei ◽

John H.L. Pang

Keyword(s):

Reliability Analysis

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Methods to achieve zero human error in semiconductors manufacturing

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342795 ◽

2006 ◽

Author(s):

Tan Chee Eng ◽

Amin Mohd Sani ◽

Puay Kim Yu

Keyword(s):

Human Error

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Mechanical and microstructure characterization of high aspect ratio electroplated through-wafer copper interconnects

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342686 ◽

2006 ◽

Cited By ~ 1

Author(s):

R. Preisser ◽

P. Backus ◽

P. Lim ◽

D. Witarsa ◽

John H.L. Pang ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio ◽

Microstructure Characterization ◽

Copper Interconnects

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Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342711 ◽

2006 ◽

Cited By ~ 11

Author(s):

X.J. Zhao ◽

J.F.J.M. Caers ◽

J.W.C. de Vries ◽

J. Kloosterman ◽

E.H. Wong ◽

...

Keyword(s):

Impact Resistance ◽

Mechanical Impact ◽

Bga Packages ◽

Solder Bumps ◽

Free Solder

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2006 8th Electronics Packaging Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

On the thermal stability margins of high-leakage current packaged devices

High-frequency characterization of embedded active components in printed circuit boards

Shape matching-assisted self-assembly of microchips on a silicon substrate

Effects of metal surface finish on the anisotropic conductive adhesives (ACAs) joints

Exploring the ulthimo platform

Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

Reliability analysis of sandwich microdisplay packaging using an integrated interferometry system

Methods to achieve zero human error in semiconductors manufacturing

Mechanical and microstructure characterization of high aspect ratio electroplated through-wafer copper interconnects

Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps

2006 8th Electronics Packaging Technology Conference
Latest Publications