Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)
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Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219743 ◽

2004 ◽

Cited By ~ 2

Author(s):

K.-C. Park ◽

I.-R. Kim ◽

B.-S. Suh ◽

S.-M. Choi ◽

W.-S. Song ◽

...

Keyword(s):

Metal Deposition ◽

Cu Interconnects ◽

Barrier Metal ◽

Deposition Technology

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Cu interconnects and low-k dielectrics, challenges for chip interconnections and packaging

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219759 ◽

2004 ◽

Cited By ~ 3

Author(s):

E. Beyne

Keyword(s):

Cu Interconnects ◽

Low K

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Mechanism for early failure in Cu dual damascene structure

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219772 ◽

2004 ◽

Author(s):

Dae-Yong Kim ◽

S.S. Wong

Keyword(s):

Early Failure ◽

Dual Damascene

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Effect of stress control layer (SCL) on via-stability in organic low-k/Cu dual damascene interconnects under thermal cycle stress

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219757 ◽

2004 ◽

Cited By ~ 3

Author(s):

M. Tagami ◽

H. Ohtake ◽

Y. Hayashi ◽

H. Miyamoto

Keyword(s):

Thermal Cycle ◽

Stress Control ◽

Dual Damascene ◽

Damascene Interconnects ◽

Low K ◽

Control Layer

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Improvement of TDDB reliability in Cu damascene interconnect by using united hard-mask and Cap (UHC) structure

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219769 ◽

2004 ◽

Cited By ~ 3

Author(s):

M. Tada ◽

Y. Harada ◽

H. Ohtake ◽

S. Saito ◽

T. Onodera ◽

...

Keyword(s):

Hard Mask

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Characteristics of ALD-TaN thin films using a novel precursors for copper metallization

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219732 ◽

2004 ◽

Cited By ~ 2

Author(s):

Kyung In Choi ◽

Byung Hee Kim ◽

Sang Woo Lee ◽

Jong Myeong Lee

Keyword(s):

Thin Films ◽

Copper Metallization

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Supercritical CO/sub 2/ for ULK/Cu integration

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219767 ◽

2004 ◽

Cited By ~ 1

Author(s):

A. Danel ◽

C. Millet ◽

V. Perrut ◽

J. Daviot ◽

V. Jousseaume ◽

...

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3-Dimentional TEM stereo observation technology for characterization of pores in low-k film

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219724 ◽

2004 ◽

Author(s):

S. Ogawa ◽

J. Shimanuki ◽

M. Shimada ◽

T. Nasuno ◽

Y. Inoue ◽

...

Keyword(s):

Low K

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Effect of CMP slurry environments on subcritical crack growth in ultra low-k dielectric materials

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219721 ◽

2004 ◽

Cited By ~ 4

Author(s):

E.P. Guyer ◽

R.H. Dauskardt

Keyword(s):

Crack Growth ◽

Subcritical Crack Growth ◽

Dielectric Materials ◽

Low K

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Backend process optimization for 90 nm high-density ASIC chips

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219731 ◽

2004 ◽

Cited By ~ 2

Author(s):

P. Zarkesh-Ha ◽

P. Wright ◽

S. Lakshminarayanan ◽

C.-C. Cheng ◽

W. Loh ◽

...

Keyword(s):

Process Optimization ◽

High Density

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Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects

Cu interconnects and low-k dielectrics, challenges for chip interconnections and packaging

Mechanism for early failure in Cu dual damascene structure

Effect of stress control layer (SCL) on via-stability in organic low-k/Cu dual damascene interconnects under thermal cycle stress

Improvement of TDDB reliability in Cu damascene interconnect by using united hard-mask and Cap (UHC) structure

Characteristics of ALD-TaN thin films using a novel precursors for copper metallization

Supercritical CO/sub 2/ for ULK/Cu integration

3-Dimentional TEM stereo observation technology for characterization of pores in low-k film

Effect of CMP slurry environments on subcritical crack growth in ultra low-k dielectric materials

Backend process optimization for 90 nm high-density ASIC chips

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)
Latest Publications