Reliability Improvement By Adopting Ti-barrier Metal For Porous Low-k ILD Structure

Mapping Intimacies ◽

10.1063/1.2815787 ◽

2007 ◽

Cited By ~ 6

Author(s):

A. Sakata ◽

S. Yamashita ◽

S. Omoto ◽

M. Hatano ◽

J. Wada ◽

...

Keyword(s):

Reliability Improvement ◽

Barrier Metal ◽

Low K

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Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure

2006 International Interconnect Technology Conference ◽

10.1109/iitc.2006.1648658 ◽

2006 ◽

Cited By ~ 4

Author(s):

A. Sakata ◽

M. Yamada ◽

M. Hasunuma ◽

S. Takahashi ◽

A. Yamada ◽

...

Keyword(s):

Reliability Improvement ◽

Barrier Metal ◽

Low K

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Reliability improvement of 9 nm-node Cu/low-k interconnects

Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) ◽

10.1109/iitc.2003.1219771 ◽

2004 ◽

Cited By ~ 1

Author(s):

S. Matsumoto ◽

A. Ishii ◽

K. Tomita ◽

K. Hashimoto ◽

Y. Nishioka ◽

...

Keyword(s):

Reliability Improvement ◽

Low K

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Reliability Improvement in Multi-level Cu/SiOC Low k Integration

13th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.2006.251009 ◽

2006 ◽

Cited By ~ 1

Author(s):

Y. W. Chen ◽

I.C. Chen ◽

Johnston Zou ◽

G. Zhang ◽

Steven Chen ◽

...

Keyword(s):

Reliability Improvement ◽

Multi Level ◽

Low K

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Impact of Barrier Metal Sputtering on Low-k SiOCH Films with Various Chemical Structures

10.7567/ssdm.2007.c-3-2 ◽

2007 ◽

Author(s):

Naoya Inoue ◽

Naoya Furutake ◽

Fuminori Ito ◽

Hironori Yamamoto ◽

Tsuneo Takeuchi ◽

...

Keyword(s):

Chemical Structures ◽

Barrier Metal ◽

Low K

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Highly Reliable and Low Resistive Cu/Low-k Dual Damascene Interconnects by Using TaTi Barrier Metal

ECS Journal of Solid State Science and Technology ◽

10.1149/2.016206jss ◽

2012 ◽

Vol 1 (6) ◽

pp. P279-P284 ◽

Cited By ~ 1

Author(s):

K. Motoyama ◽

K. Fujii

Keyword(s):

Dual Damascene ◽

Barrier Metal ◽

Damascene Interconnects ◽

Low K

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Reliability improvement of 90nm large flip chip low-k die via dicing and assembly process optimization

2006 8th Electronics Packaging Technology Conference ◽

10.1109/eptc.2006.342785 ◽

2006 ◽

Cited By ~ 4

Author(s):

Raghunandan Chaware ◽

Lan Hoang

Keyword(s):

Process Optimization ◽

Flip Chip ◽

Assembly Process ◽

Reliability Improvement ◽

Low K

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Impact of oxygen on Cu surface for highly reliable low-k/Cu interconnects with CuSiN and Ti-based barrier metal

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510456 ◽

2010 ◽

Cited By ~ 2

Author(s):

Y. Hayashi ◽

N. Matsunaga ◽

M. Wada ◽

S. Nakao ◽

K. Watanabe ◽

...

Keyword(s):

Cu Interconnects ◽

Barrier Metal ◽

Low K

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Reliability improvement of Cu/low-k interconnects by integrating novel single pass single wafer wet clean

ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005. ◽

10.1109/issm.2005.1513331 ◽

2005 ◽

Cited By ~ 2

Author(s):

R. Chang ◽

Jianshe Tang ◽

S. Verhaverbeke ◽

K. Smekalin ◽

J.T.C. Lee ◽

...

Keyword(s):

Single Pass ◽

Reliability Improvement ◽

Low K

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Ti-barrier Metal for Robust and Reliable 45nm Node Porous Low-k/Copper Interconnects

10.7567/ssdm.2006.g-1-2 ◽

2006 ◽

Author(s):

K. Higashi ◽

H. Yamaguchi ◽

T. Yosho ◽

A. Sakata ◽

S. Omoto ◽

...

Keyword(s):

Copper Interconnects ◽

Barrier Metal ◽

Low K

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Impact of barrier metal on electrical performance of Cu/low K (Black Diamond™) in 0.13μm dual damascene interconnection

Thin Solid Films ◽

10.1016/j.tsf.2004.05.052 ◽

2004 ◽

Vol 462-463 ◽

pp. 245-249 ◽

Cited By ~ 2

Author(s):

H.Y. Li ◽

C.Y. Li ◽

Y.J. Su ◽

C.F. Tsang

Keyword(s):

Electrical Performance ◽

Dual Damascene ◽

Barrier Metal ◽

Low K

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