Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)

2007 ◽  
Author(s):  
John Lau ◽  
Jeffery Lo ◽  
Jimmy Lam ◽  
Eng-Leong Soon ◽  
Woai-Sheng Chow ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Ball Grid Array ◽  
Circuit Board ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Packages

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

1999 ◽  
Vol 121 (4) ◽  
pp. 242-248 ◽  
Author(s):  
J. Lau ◽  
T. Chen ◽  
S.-W. R. Lee
Keyword(s):  
Printed Circuit Board ◽  
Cost Effective ◽  
Ball Grid Array ◽  
Circuit Board ◽  
Cooling Power ◽  
Heat Spreader ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Solder Balls ◽  
Ball Grid Array Packages

The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35 mm and 40 × 40 mm with 4 and 5 rows of solder balls.

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

1997 ◽  
Vol 119 (3) ◽  
pp. 208-212 ◽  
Author(s):  
J. H. Lau ◽  
K.-L. Chen
Keyword(s):  
Thermal Loading ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Ball Grid Array ◽  
Organic Substrate ◽  
Circuit Board ◽  
Heat Spreader ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package

The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
Hung-Jen Chang ◽  
Chau-Jie Zhan ◽  
Tao-Chih Chang ◽  
Jung-Hua Chou
Keyword(s):  
Printed Circuit Board ◽  
Drop Test ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Circuit Board Assembly ◽  
Halogen Free ◽  
Board Level ◽  
The Impact

In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0Ag0.5Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn1.0Ag0.5Cu solder paste on the Cu pad surfaces of either organic solderable preservative (OSP) or electroless nickel immersion gold (ENIG). The assembly was tested for the effect of the formation extent of Ag3Sn intermetallic compound. Afterward a board-level pulse-controlled drop test was conducted on the as-reflowed assemblies according to the JESD22-B110 and JESD22-B111 standards, the impact performance of various surface finished halogen-free printed circuit board assembly was evaluated. The test results showed that most of the fractures occurred around the pad on the test board first. Then cracks propagated across the outer build-up layer. Finally, the inner copper trace was fractured due to the propagated cracks, resulting in the failure of the PCB side. Interfacial stresses numerically obtained by the transient stress responses supported the test observation as the simulated initial crack position was the same as that observed.

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