2007 9th Electronics Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

175

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424413249, 9781424413232

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469816 ◽

2007 ◽

Cited By ~ 1

Author(s):

Ming-Yao Chen ◽

Chao-Chyun An ◽

Shyh-Ming Chang ◽

Kuo-Shu Kao ◽

Jimmy Tsang ◽

...

Keyword(s):

Experimental Results ◽

Stress Calculation ◽

Theoretical Stress

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Study on Sn-2.3Ag Electroplated Solder Bump Properties Fabricated by Different Plating and Reflow Conditions

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469686 ◽

2007 ◽

Author(s):

C. K. Hsiung ◽

C. A. Chang ◽

Z. H. Tzeng ◽

C. S. Ho ◽

F. L. Chien

Keyword(s):

Solder Bump

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Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469818 ◽

2007 ◽

Cited By ~ 4

Author(s):

J. Lee ◽

M. Mayer ◽

Y. Zhou ◽

J. Persic

Keyword(s):

Bonding Process ◽

Breaking Force ◽

Pull Force ◽

Force Optimization

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Building Accuracies in Finite Element Models for Life Prediction of Solder Joints

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469763 ◽

2007 ◽

Cited By ~ 2

Author(s):

Ahmer Syed ◽

SeokBong Kim ◽

Wei Lin

Keyword(s):

Finite Element ◽

Life Prediction ◽

Solder Joints ◽

Finite Element Models

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MCP Bottom Die Crack Issue during Destructive Analysis

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469685 ◽

2007 ◽

Cited By ~ 1

Author(s):

Yuqi Jiang ◽

Xianzhong Song ◽

TimFai Lam ◽

Caihong Wu ◽

Mingxia Sun ◽

...

Keyword(s):

Destructive Analysis

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Thermal Characterisation and Liquid Cooling System Integration for Stacked Modules

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469821 ◽

2007 ◽

Cited By ~ 4

Author(s):

S.P. Tan ◽

K.C. Toh ◽

J.C. Chai ◽

D. Pinjala ◽

O.K. Navas Khan

Keyword(s):

System Integration ◽

Cooling System ◽

Liquid Cooling ◽

Liquid Cooling System

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Hybrid Heterogeneous Imaging Arrays with Reinforced Functionality and Reliability

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469841 ◽

2007 ◽

Cited By ~ 1

Author(s):

Francois Marion ◽

Gilles Lasfargues ◽

Herve Ribot ◽

Christophe Largeron ◽

Laeticia Adelmini ◽

...

Keyword(s):

Imaging Arrays

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Reliability Study on Copper Pillar Bumping with Lead Free Solder

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469726 ◽

2007 ◽

Cited By ~ 13

Author(s):

Jinhua Yu ◽

Ashok Anand ◽

YC Mui ◽

Parthasarathy Srinivasan ◽

Raj Master

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Reliability Study ◽

Free Solder

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Design Reliable Large FCTEBGA through Integrated Experimental and Numerical Method

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469745 ◽

2007 ◽

Author(s):

Jing-en Luan

Keyword(s):

Numerical Method

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Accelerated Ageing and Solderability Test of Tin Plated Components

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469716 ◽

2007 ◽

Author(s):

Marc Dittes ◽

Gerhard Haubner

Keyword(s):

Accelerated Ageing

Download Full-text

2007 9th Electronics Packaging Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"

Study on Sn-2.3Ag Electroplated Solder Bump Properties Fabricated by Different Plating and Reflow Conditions

Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire

Building Accuracies in Finite Element Models for Life Prediction of Solder Joints

MCP Bottom Die Crack Issue during Destructive Analysis

Thermal Characterisation and Liquid Cooling System Integration for Stacked Modules

Hybrid Heterogeneous Imaging Arrays with Reinforced Functionality and Reliability

Reliability Study on Copper Pillar Bumping with Lead Free Solder

Design Reliable Large FCTEBGA through Integrated Experimental and Numerical Method

Accelerated Ageing and Solderability Test of Tin Plated Components

2007 9th Electronics Packaging Technology Conference
Latest Publications