Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Encapsulating the active Layer of organic Thin-Film Transistors

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596488 ◽

2006 ◽

Cited By ~ 2

Author(s):

C. Pannemann ◽

T. Diekmann ◽

U. Hilleringmann ◽

U. Schurmann ◽

M. Scharnberg ◽

...

Keyword(s):

Thin Film ◽

Active Layer ◽

Thin Film Transistors ◽

Organic Thin Film Transistors ◽

Organic Thin Film

Download Full-text

Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596517 ◽

2006 ◽

Cited By ~ 4

Author(s):

J. Borecki ◽

J. Felba ◽

W. Posadowski

Keyword(s):

Magnetron Sputtering ◽

High Density ◽

Sputtering Deposition

Download Full-text

Lead-free Assembly Defects in Plastic Ball Grid Array Packages

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596523 ◽

2006 ◽

Cited By ~ 4

Author(s):

S. Ganesan ◽

Geunwoo Kim ◽

Ji Wu ◽

M. Pecht ◽

J. Felba

Keyword(s):

Ball Grid Array ◽

Lead Free ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

Download Full-text

Study on the Fabrication Process and Reliability Performance of Contactless Smart Card Using Nonconductive Film

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596496 ◽

2006 ◽

Author(s):

Y. Ma ◽

Y.C. Chan

Keyword(s):

Smart Card ◽

Fabrication Process ◽

Reliability Performance ◽

Contactless Smart Card

Download Full-text

Selection criteria of press-materials and packaging conditions for power electron devices

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596506 ◽

2006 ◽

Author(s):

V.V. Baranov ◽

V.A. Emelyanov ◽

A.F. Kerentsev ◽

D.L. Anufriev

Keyword(s):

Selection Criteria ◽

Electron Devices

Download Full-text

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596478 ◽

2006 ◽

Author(s):

Gou Toida ◽

Y. Shirai ◽

N. Mizmura ◽

M. Komagata ◽

K. Suzuki

Keyword(s):

Conductive Filler ◽

Conductive Adhesives

Download Full-text

Problems of PCB Microvias Filling by Conductive Paste

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596495 ◽

2006 ◽

Author(s):

R. Kisiel ◽

J. Felba ◽

J. Borecki ◽

A. Moscicki

Download Full-text

Investigation of Environmental Reliability of Optical Polymer Waveguides Embedded on Printed Circuit Boards

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596505 ◽

2006 ◽

Author(s):

M. Immonen ◽

M. Karppinen ◽

J.K. Kivilahti

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Polymer Waveguides ◽

Printed Circuit ◽

Optical Polymer

Download Full-text

High Surface Planarity Die Bonding of Large Optical Chips

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596499 ◽

2006 ◽

Author(s):

U. Kunzelmann ◽

M. Wagner ◽

H. Schenk ◽

H. Lakner

Keyword(s):

High Surface ◽

Die Bonding

Download Full-text

Organic Semiconductors Providing New Solutions for Future Medical Implants

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596491 ◽

2006 ◽

Author(s):

M. Schwarz ◽

J. Buddefeld ◽

V. Ortmann

Keyword(s):

Organic Semiconductors ◽

Medical Implants

Download Full-text

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Encapsulating the active Layer of organic Thin-Film Transistors

Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's

Lead-free Assembly Defects in Plastic Ball Grid Array Packages

Study on the Fabrication Process and Reliability Performance of Contactless Smart Card Using Nonconductive Film

Selection criteria of press-materials and packaging conditions for power electron devices

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Problems of PCB Microvias Filling by Conductive Paste

Investigation of Environmental Reliability of Optical Polymer Waveguides Embedded on Printed Circuit Boards

High Surface Planarity Die Bonding of Large Optical Chips

Organic Semiconductors Providing New Solutions for Future Medical Implants

Export Citation Format

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and PhotonicsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Encapsulating the active Layer of organic Thin-Film Transistors

Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's

Lead-free Assembly Defects in Plastic Ball Grid Array Packages

Study on the Fabrication Process and Reliability Performance of Contactless Smart Card Using Nonconductive Film

Selection criteria of press-materials and packaging conditions for power electron devices

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler

Problems of PCB Microvias Filling by Conductive Paste

Investigation of Environmental Reliability of Optical Polymer Waveguides Embedded on Printed Circuit Boards

High Surface Planarity Die Bonding of Large Optical Chips

Organic Semiconductors Providing New Solutions for Future Medical Implants

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Latest Publications