Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

1999 ◽  
Vol 121 (4) ◽  
pp. 242-248 ◽  
Author(s):  
J. Lau ◽  
T. Chen ◽  
S.-W. R. Lee
Keyword(s):  
Printed Circuit Board ◽  
Cost Effective ◽  
Ball Grid Array ◽  
Circuit Board ◽  
Cooling Power ◽  
Heat Spreader ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Solder Balls ◽  
Ball Grid Array Packages

The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35 mm and 40 × 40 mm with 4 and 5 rows of solder balls.

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

1997 ◽  
Vol 119 (3) ◽  
pp. 208-212 ◽  
Author(s):  
J. H. Lau ◽  
K.-L. Chen
Keyword(s):  
Thermal Loading ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Ball Grid Array ◽  
Organic Substrate ◽  
Circuit Board ◽  
Heat Spreader ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Package

The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

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