Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780341570

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A study on accelerated preconditioning test

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723893 ◽

2002 ◽

Cited By ~ 1

Author(s):

Y. Sun ◽

E.C. Wong ◽

C.H. Ng

Download Full-text

Processing and reliability of flip-chip on board connections

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723918 ◽

2002 ◽

Author(s):

P.A. Collier ◽

K.H. Teo

Keyword(s):

Flip Chip

Download Full-text

Processing induced material interactions determining the reliability of LTCC MCM-Cs

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723915 ◽

2002 ◽

Author(s):

G. Harsanyi

Download Full-text

Process characterization on chemical deflash; leading to the elimination of over-etched leads

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723900 ◽

2002 ◽

Author(s):

R.F. Dela Cruz

Keyword(s):

Process Characterization

Download Full-text

Application of moire interferometry in electronics packaging

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723922 ◽

2002 ◽

Cited By ~ 4

Author(s):

H.M. Ho ◽

K.E. Oh ◽

E.H. Wong ◽

T.B. Lim

Keyword(s):

Electronics Packaging ◽

Moiré Interferometry ◽

Moire Interferometry

Download Full-text

Electro magnetic simulation and measurement of electrical parasitics in high density QFP packages

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723928 ◽

2002 ◽

Cited By ~ 3

Author(s):

M.K. Iyer ◽

F. Lin ◽

H.H. Hia ◽

S. Prasanna

Keyword(s):

High Density ◽

Electro Magnetic

Download Full-text

Thermal contact conductance of typical interfaces in electronic packages under low contact pressures

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723899 ◽

2002 ◽

Cited By ~ 1

Author(s):

K.C. Toh ◽

K.K. Ng

Keyword(s):

Thermal Contact ◽

Thermal Contact Conductance ◽

Electronic Packages ◽

Contact Conductance ◽

Contact Pressures

Download Full-text

The optimum thermal design of microchannel heat sinks

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723898 ◽

2002 ◽

Cited By ~ 11

Author(s):

W. Zhimin ◽

C.K. Fah

Keyword(s):

Thermal Design ◽

Heat Sinks ◽

Microchannel Heat Sinks

Download Full-text

The role of surface morphology on interfacial adhesion in IC packaging

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723910 ◽

2002 ◽

Cited By ~ 5

Author(s):

C. Lee ◽

I. Rasiah ◽

T.C. Chai ◽

R. Gopalakrishnan

Keyword(s):

Surface Morphology ◽

Interfacial Adhesion ◽

Ic Packaging

Download Full-text

Microelectronics-challenges and changes in the next 15 years

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) ◽

10.1109/eptc.1997.723877 ◽

2002 ◽

Author(s):

H. Bierhenke ◽

A.W. Wieder

Download Full-text

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A study on accelerated preconditioning test

Processing and reliability of flip-chip on board connections

Processing induced material interactions determining the reliability of LTCC MCM-Cs

Process characterization on chemical deflash; leading to the elimination of over-etched leads

Application of moire interferometry in electronics packaging

Electro magnetic simulation and measurement of electrical parasitics in high density QFP packages

Thermal contact conductance of typical interfaces in electronic packages under low contact pressures

The optimum thermal design of microchannel heat sinks

The role of surface morphology on interfacial adhesion in IC packaging

Microelectronics-challenges and changes in the next 15 years

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)
Latest Publications