An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

2002 ◽  
Author(s):  
S.-W. Ricky Lee ◽  
C.C. Yan ◽  
L.W. Chow ◽  
M. Papageorge
Keyword(s):  
Experimental Investigation ◽  
Thermal Cycling ◽  
Ball Grid Array ◽  
High Humidity ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Packages

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

2009 ◽  
Vol 32 (4) ◽  
pp. 901-908 ◽  
Author(s):  
Lei Nie ◽  
M. Osterman ◽  
Fubin Song ◽  
J. Lo ◽  
S.W.R. Lee ◽  
...  
Keyword(s):  
Solder Ball ◽  
Ball Grid Array ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Ball Grid Array Packages
Sign in / Sign up

Export Citation Format

Share Document