Lead-free Assembly Defects in Plastic Ball Grid Array Packages

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics ◽

10.1109/polytr.2005.1596523 ◽

2006 ◽

Cited By ~ 4

Author(s):

S. Ganesan ◽

Geunwoo Kim ◽

Ji Wu ◽

M. Pecht ◽

J. Felba

Keyword(s):

Ball Grid Array ◽

Lead Free ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Thermal characterization of plastic ball grid array packages via infrared thermography

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.928010 ◽

2002 ◽

Author(s):

L. Sweatlock ◽

D. Lischner ◽

J. Weiss

Keyword(s):

Infrared Thermography ◽

Ball Grid Array ◽

Thermal Characterization ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066961 ◽

2011 ◽

Cited By ~ 1

Author(s):

Zhao Qiang ◽

Dejian Zhou

Keyword(s):

Life Prediction ◽

Ball Grid Array ◽

Fatigue Life Prediction ◽

Lead Free ◽

Lead Free Solder ◽

Response Surface Methods ◽

Thermal Fatigue Life ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Free Solder

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Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages

Fracture and Strength of Solids VI - Key Engineering Materials ◽

10.4028/0-87849-989-x.1043 ◽

2006 ◽

pp. 1043-1048

Author(s):

Yi-Ming Jen ◽

Hsi Hsin Chien ◽

Tsung-Shu Lin ◽

Shih Hsiang Huang

Keyword(s):

Solder Ball ◽

Flip Chip ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) ◽

10.1109/ectc.2000.853326 ◽

2002 ◽

Cited By ~ 14

Author(s):

K.-M. Levis ◽

A. Mawer

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Lead Free ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array

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Flow modeling and visualization of the transfer molding of plastic ball grid array packages

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) ◽

10.1109/ectc.1999.776168 ◽

2003 ◽

Cited By ~ 2

Author(s):

L.T. Nguyen ◽

C.G. Quentin ◽

W.W. Lee

Keyword(s):

Ball Grid Array ◽

Flow Modeling ◽

Transfer Molding ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Solder ball failure mechanisms in plastic ball grid array packages

Soldering & Surface Mount Technology ◽

10.1108/09540910210427817 ◽

2002 ◽

Vol 14 (2) ◽

pp. 40-50 ◽

Cited By ~ 4

Author(s):

C.H. Zhong ◽

S. Yi ◽

D.C. Whalley

Keyword(s):

Solder Ball ◽

Failure Mechanisms ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2009.2021392 ◽

2009 ◽

Vol 32 (4) ◽

pp. 901-908 ◽

Cited By ~ 7

Author(s):

Lei Nie ◽

M. Osterman ◽

Fubin Song ◽

J. Lo ◽

S.W.R. Lee ◽

...

Keyword(s):

Solder Ball ◽

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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A study of moisture and thermally induced die stresses in plastic ball grid array packages

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2017.7992622 ◽

2017 ◽

Author(s):

Quang Nguyen ◽

Jordan C. Roberts ◽

Jeffrey C. Suhling ◽

Richard C. Jaeger

Keyword(s):

Ball Grid Array ◽

Thermally Induced ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages

Circuit World ◽

10.1108/03056129710800080 ◽

1997 ◽

Vol 23 (1) ◽

pp. 16-19 ◽

Cited By ~ 14

Author(s):

S.‐W. Lee ◽

J.H. Lau

Keyword(s):

Solder Joint ◽

Ball Grid Array ◽

Substrate Thickness ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages*

Soldering & Surface Mount Technology ◽

10.1108/09540919610777591 ◽

1996 ◽

Vol 8 (1) ◽

pp. 46-50 ◽

Cited By ~ 15

Author(s):

R. Munamarty ◽

P. McCluskey ◽

M. Pecht ◽

L. Yip

Keyword(s):

Ball Grid Array ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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