Ball impact responses and failure analysis of wafer-level chip-scale packages

2006 ◽  
Author(s):  
Yi-Shao Lai ◽  
ChangLlin Yeh ◽  
Hsiao-Chuan Chang ◽  
Chin-Li Kao
Keyword(s):  
Failure Analysis ◽  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses

Characterizations of ball impact responses of wafer-level chip-scale packages

2008 ◽  
Vol 450 (1-2) ◽  
pp. 238-244 ◽  
Author(s):  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Hsiao-Chuan Chang ◽  
Chin-Li Kao
Keyword(s):  
Wafer Level ◽  
Ball Impact ◽  
Impact Responses

Sample Preparation Challenges In WLCSP Epoxy Underfill Coating Removal

2012 ◽  
Author(s):  
Jason H. Lagar ◽  
Rudolf A. Sia
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Vital Role ◽  
Fault Isolation ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Coating Removal ◽  
Customer Returns ◽  
Preparation Techniques ◽  
Mechanical Defect

Abstract Most Wafer Level Chip Scale Package (WLCSP) units returned by customers for failure analysis are mounted on PCB modules with an epoxy underfill coating. The biggest challenge in failure analysis is the sample preparation to remove the WLCSP device from the PCB without inducing any mechanical defect. This includes the removal of the underfill material to enable further electrical verification and fault isolation analysis. This paper discusses the evaluations conducted in establishing the WLCSP demounting process and removal of the epoxy underfill coating. Combinations of different sample preparation techniques and physical failure analysis steps were evaluated. The established process enabled the electrical verification, fault isolation and further destructive analysis of WLCSP customer returns mounted on PCB and with an epoxy underfill coating material. This paper will also showcase some actual full failure analysis of WLCSP customer returns where the established process played a vital role in finding the failure mechanism.

Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect

2009 ◽  
Vol 6 (1) ◽  
pp. 59-65
Author(s):  
Karan Kacker ◽  
Suresh K. Sitaraman
Keyword(s):  
Failure Analysis ◽  
Dielectric Material ◽  
Organic Substrate ◽  
Wafer Level ◽  
Free Standing ◽  
Fine Pitch ◽  
Cross Section Area ◽  
Interconnect Reliability ◽  
Compliant Interconnect ◽  
Low K

Continued miniaturization in the microelectronics industry calls for chip-to-substrate off-chip interconnects that have 100 μm pitch or less for area-array format. Such fine-pitch interconnects will have a shorter standoff height and a smaller cross-section area, and thus could fail through thermo-mechanical fatigue prematurely. Also, as the industry transitions to porous low-K dielectric/Cu interconnect structures, it is important to ensure that the stresses induced by the off-chip interconnects and the package configuration do not crack or delaminate the low-K dielectric material. Compliant free-standing structures used as off-chip interconnects are a potential solution to address these reliability concerns. In our previous work we have proposed G-Helix interconnects, a lithography-based electroplated compliant off-chip interconnect that can be fabricated at the wafer level. In this paper we develop an assembly process for G-Helix interconnects at a 100 μm pitch, identifying the critical factors that impact the assembly yield of such free-standing compliant interconnect. Reliability data are presented for a 20 mm × 20 mm chip with G-Helix interconnects at a 100 μm pitch assembled on an organic substrate and subjected to accelerated thermal cycling. Subsequent failure analysis of the assembly is performed and limited correlation is shown with failure location predicted by finite elements models.

Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu ◽  
Chang-Lin Yeh ◽  
Jenn-Ming Song
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 201-209 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Failure analysis of wafer-level reliability testing failure

1999 ◽  
Author(s):  
Chong K. Oh ◽  
Soh P. Neo ◽  
Jian H. Bi ◽  
Zong M. Wu ◽  
Lian C. Goh ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Reliability Testing ◽  
Wafer Level

Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles
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