immersion tin
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2020 ◽  
Vol 49 (12) ◽  
pp. 3201-3205
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Siti Farahnabilah Muhd Amli ◽  
Nurul Razliana Abdul Razak

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.


2020 ◽  
Vol 49 (12) ◽  
pp. 3255-3259
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Siti Farahnabilah Muhd Amli ◽  
Nurul Razliana Abdul Razak

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.


2016 ◽  
Vol 864 ◽  
pp. 175-179
Author(s):  
Mohamed Arif Azmah Hanim ◽  
M.N. Mohamad Aznan ◽  
R. Muhammad Raimi ◽  
A. Muhammad Azrol Amin

This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7wt.%) reinforced with 0.01 wt.% of Multi-Walled Carbon Nanotubes (MWCNTs) were soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Isothermal aging at 150°C for 400h, 800h, and 1200h were conducted after as reflow process. The IMC layer were analysed using optical microscope with image analyzer. The results shows the thickness of IMC layer for both ENIG and ImSn increased as the isothermal aging period increases. The increament was found from 1.49 μm to 1.73 μm for ENIG and 2.51 μm to 5.49 μm for ImSn. Floating IMC and voids formation were also observed on both pad finishes. Wetting angle for ENIG and ImSn varied from 16.21° to 36.85° and 24.27° to 34.41° respectively.


2016 ◽  
Vol 701 ◽  
pp. 127-131
Author(s):  
Hardinnawirda Kahar ◽  
Zetty Akhtar Abd Malek ◽  
Siti Rabiatull Aisha Idris ◽  
Mahadzir Ishak

The formation and growth of the intermetallic were frequently discussed since lead free solder took place replacing the lead solder. However, the effect of multiple reflow process on the intermetallic morphology that was subjected to aging still needs further investigation. Thus, this study aimed to investigate the effect of second reflow towards the intermetallic compound formation and growth. Two types of surface finishes were used such as Immersion Tin (ImSn) and Electroless Nickel Immersion Gold (ENIG). Both test boards were reflowed once with Sn-3Ag-0.5Cu at the temperature of 225 °C and soaking for 8 seconds. Then, they were reflowed again at the same temperature for 25 minutes prior to an isothermal aging process for 250, 500, 1000 and 2000 hours at the temperature of 150 °C. The ProgRes C3 IM7200 Optical Microscope and ImageJ were used for the microstructural study, which includes morphology and thickness. Results indicated that IMC thickness formed between solder and ImSn surface finish increased significantly with 1.28 µm incremental when exposed to the second reflow. Whereas the IMC thickness of ENIG surface finish was increased for up to 0.15 µm. In addition, ENIG showed higher activation energy as compared to ImSn.


2016 ◽  
Vol 857 ◽  
pp. 36-39
Author(s):  
Maria Abu Bakar ◽  
Azman Jalar ◽  
Roslina Ismail ◽  
Abdul Razak Daud

Directional growth behavior of intermetallic compound (IMC) layer of Sn3.0Ag0.5Cu (SAC305) on immersion tin (ImSn) surface finished Cu substrate was investigated. The samples of SAC305 on ImSn/Cu substrate were subjected to thermal cycling at temperatures between 0 °C and 100 °C for 0 cycle up to 500 cycles. The cross-sectioned microstructures of soldered samples, SAC305 on ImSn/Cu were observed using optical microscope. The shape and orientation of IMC growth on the SAC305 on ImSn/Cu indicates that the orientation of IMC growth were observed to be non-uniform and dispersed throughout the solder joint with longer thermal cycling test.


2015 ◽  
Vol 2 ◽  
pp. 275-279 ◽  
Author(s):  
Hooi Peng Lim ◽  
Ali Ourdjini ◽  
Tuty Asma Abu Bakar ◽  
Tuquabo Tesfamichael

2015 ◽  
Vol 66 (10) ◽  
pp. 443-446
Author(s):  
Takeshi YAMAMURA
Keyword(s):  

2014 ◽  
Vol 695 ◽  
pp. 301-305 ◽  
Author(s):  
Nor Akmal Fadil ◽  
Siti Zahira Yusof ◽  
Ali Ourdjini ◽  
Tuty Asma Abu Bakar

The effect of the formation of CuO flowers and SnO2on tin whiskers formation and growth in 30°C/60%RH environmental condition for tin surface finish had been studied. Immersion plating method was used to coat a layer of tin onto a copper, Cu substrates. The coated surface was subjected to external stress by micro hardness indenter with 2N load in order to simulate an external stress in coating layer and to promote the formation of tin whiskers. FESEM and EDX was used to study the type and chemical composition of whiskers and oxides formed. Image analyser was used to measure the whiskers length using JEDEC Standard No 22-A121A. After 1 week of the exposure under 30°C/60%RH environmental condition, kinked-type whiskers were formed and the whiskers growth were discontinued at week 4 due to the distruction at the end-tip of kinked-type tin whisker to grow further when it touched the coating surface. An obervation until 52 weeks of exposure time found that the formation and growth of CuO flowers and the oxidation of non-kinked-type of tin whiskers to form SnO2promoted by external stress also contributed to the discontinuity of whiskers growth.


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