interconnect reliability
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The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability

2020 ◽  
Vol 31 (18) ◽  
pp. 15530-15538
Author(s):  
Hyodong Ryu ◽  
Kirak Son ◽  
Jeong Sam Han ◽  
Young-Bae Park ◽  
Tae-Kyu Lee
Keyword(s):  
Interconnect Reliability

Improving Copper Interconnect Reliability via Ta/Ti Based Barrier

2019 ◽  
Vol 34 (1) ◽  
pp. 775-780
Author(s):  
Xiao-Wen Hu ◽  
Paulchang Lin ◽  
Jenny Ma ◽  
Jian-Yong Jiang ◽  
Peng He
Keyword(s):  
Copper Interconnect ◽  
Interconnect Reliability

scholarly journals Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature

2019 ◽  
pp. 1902397 ◽  
Author(s):  
Chun‐Li Lo ◽  
Massimo Catalano ◽  
Ava Khosravi ◽  
Wanying Ge ◽  
Yujin Ji ◽  
...  
Keyword(s):  
Low Temperature ◽  
Tantalum Sulfide ◽  
Interconnect Reliability ◽  
And Performance

Pathfinding of Ru-Liner/Cu-Reflow Interconnect Reliability Solution

2018 ◽  
Author(s):  
Zhiyuan Wu ◽  
Feng Chen ◽  
Gang Shen ◽  
Yufei Hu ◽  
Shirish Pethe ◽  
...  
Keyword(s):  
Interconnect Reliability
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