Slow wave and dielectric quasi-TEM modes of Metal-Insulator-Semiconductor (MIS) structure Through Silicon Via (TSV) in signal propagation and power delivery in 3D chip package
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2014 ◽
Vol 29
(7)
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pp. 075001
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2020 ◽
Vol 31
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pp. 19846-19851
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2004 ◽
Vol 41
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pp. 366-369
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2017 ◽
Vol 5
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pp. 7715-7719
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