2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
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9781424464104
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Three chips stacking with low volume solder using single re-flow process

2010 ◽  
Author(s):  
Navas Khan ◽  
David Ho Soon Wee ◽  
Ong Siong Chiew ◽  
Cheryl Sharmani ◽  
Li Shiah Lim ◽  
...  
Keyword(s):  
Flow Process ◽  
Low Volume

Design and fabrication of a reliability test chip for 3D-TSV

2010 ◽  
Author(s):  
A D Trigg ◽  
Li Hong Yu ◽  
Xiaowu Zhang ◽  
Chai Tai Chong ◽  
Cheng Cheng Kuo ◽  
...  
Keyword(s):  
Reliability Test ◽  
Test Chip

Micro tube insertion into indium, copper and other materials for 3D applications

2010 ◽  
Author(s):  
B. Goubault de Brugiere ◽  
F. Marion ◽  
M. Fendler ◽  
V. Mandrillon ◽  
A. Hazotte ◽  
...  
Keyword(s):  
Tube Insertion ◽  
3D Applications
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