Low temperature bump-less Cu-Cu bonding enhancement with self assembled monolayer (SAM) passivation for 3-D integration

2010 ◽  
Author(s):  
Dau Fatt Lim ◽  
Jun Wei ◽  
Chee Mang Ng ◽  
Chuan Seng Tan
Keyword(s):  
Low Temperature ◽  
Self Assembled Monolayer ◽  
Self Assembled ◽  
Cu Bonding

The dynamic behaviour of a single molecule inserted in a self-assembled monolayer matrix at low temperature

2004 ◽  
Vol 15 (4) ◽  
pp. S137-S141 ◽  
Author(s):  
Satoshi Wakamatsu ◽  
Shintaro Fujii ◽  
Uichi Akiba ◽  
Masamichi Fujihira
Keyword(s):  
Low Temperature ◽  
Single Molecule ◽  
Dynamic Behaviour ◽  
Self Assembled Monolayer ◽  
Self Assembled

Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

2017 ◽  
Vol 57 (2S1) ◽  
pp. 02BB01 ◽  
Author(s):  
Weixin Fu ◽  
Bo Ma ◽  
Hiroyuki Kuwae ◽  
Shuichi Shoji ◽  
Jun Mizuno
Keyword(s):  
Low Temperature ◽  
Self Assembled Monolayer ◽  
Self Assembled

Enhancing Cu-Cu Diffusion Bonding at Low Temperature Via Application of Self-assembled Monolayer Passivation

2011 ◽  
Vol 158 (10) ◽  
pp. H1057 ◽  
Author(s):  
D. F. Lim ◽  
S. K. Goulet ◽  
M. Bergkvist ◽  
J. Wei ◽  
K. C. Leong ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Self Assembled Monolayer ◽  
Self Assembled
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