Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

2012 ◽  
Vol 52 (2) ◽  
pp. 321-324 ◽  
Author(s):  
C.S. Tan ◽  
D.F. Lim ◽  
X.F. Ang ◽  
J. Wei ◽  
K.C. Leong
2004 ◽  
Vol 15 (4) ◽  
pp. S137-S141 ◽  
Author(s):  
Satoshi Wakamatsu ◽  
Shintaro Fujii ◽  
Uichi Akiba ◽  
Masamichi Fujihira

2017 ◽  
Vol 57 (2S1) ◽  
pp. 02BB01 ◽  
Author(s):  
Weixin Fu ◽  
Bo Ma ◽  
Hiroyuki Kuwae ◽  
Shuichi Shoji ◽  
Jun Mizuno

2011 ◽  
Vol 158 (10) ◽  
pp. H1057 ◽  
Author(s):  
D. F. Lim ◽  
S. K. Goulet ◽  
M. Bergkvist ◽  
J. Wei ◽  
K. C. Leong ◽  
...  

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