Enhancing Cu-Cu Diffusion Bonding at Low Temperature Via Application of Self-assembled Monolayer Passivation
2011 ◽
Vol 158
(10)
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pp. H1057
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2017 ◽
Vol 57
(2S1)
◽
pp. 02BB01
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2017 ◽
Vol 108
(7)
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pp. 571-577
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2012 ◽
Vol 52
(2)
◽
pp. 321-324
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