(Invited) Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature

2013 ◽  
Vol 50 (7) ◽  
pp. 115-123 ◽  
Author(s):  
C. S. Tan ◽  
D. F. Lim
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Surface Passivation ◽  
Self Assembled Monolayer ◽  
Self Assembled

The dynamic behaviour of a single molecule inserted in a self-assembled monolayer matrix at low temperature

2004 ◽  
Vol 15 (4) ◽  
pp. S137-S141 ◽  
Author(s):  
Satoshi Wakamatsu ◽  
Shintaro Fujii ◽  
Uichi Akiba ◽  
Masamichi Fujihira
Keyword(s):  
Low Temperature ◽  
Single Molecule ◽  
Dynamic Behaviour ◽  
Self Assembled Monolayer ◽  
Self Assembled

Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

2017 ◽  
Vol 57 (2S1) ◽  
pp. 02BB01 ◽  
Author(s):  
Weixin Fu ◽  
Bo Ma ◽  
Hiroyuki Kuwae ◽  
Shuichi Shoji ◽  
Jun Mizuno
Keyword(s):  
Low Temperature ◽  
Self Assembled Monolayer ◽  
Self Assembled
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