2013 IEEE International 3D Systems Integration Conference (3DIC)
Latest Publications

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Published By IEEE

9781467364843

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A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702363 ◽

2013 ◽

Cited By ~ 3

Author(s):

K. Kiyoyama ◽

Y. Sato ◽

H. Hashimoto ◽

K-W Lee ◽

T. Fukushima ◽

...

Keyword(s):

Cmos Image Sensor ◽

Image Sensor ◽

Noise Cancelling

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Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702340 ◽

2013 ◽

Author(s):

D. Gope ◽

S. Chatterjee ◽

D. de Araujo ◽

S. Chakraborty ◽

J. Pingenot ◽

...

Keyword(s):

System Modeling ◽

Electromagnetic Simulation ◽

Device Physics ◽

Through Silicon Vias ◽

Silicon Vias

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Improving 3D-Floorplanning using smart selection operations in meta-heuristic optimization

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702337 ◽

2013 ◽

Cited By ~ 4

Author(s):

Artur Quiring ◽

Markus Olbrich ◽

Erich Barke

Keyword(s):

Heuristic Optimization

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A scalable multi-dimensional NoC simulation model for diverse spatio-temporal traffic patterns

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702365 ◽

2013 ◽

Cited By ~ 3

Author(s):

Awet Yemane Weldezion ◽

Matt Grange ◽

Dinesh Pamunuwa ◽

Axel Jantsch ◽

Hannu Tenhunen

Keyword(s):

Simulation Model ◽

Traffic Patterns ◽

Spatio Temporal

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The monolithic 3D advantage: Monolithic 3D is far more than just an alternative to 0.7x scaling

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702316 ◽

2013 ◽

Cited By ~ 5

Author(s):

Zvi Or-Bach

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A novel circuit model for multiple Through Silicon Vias (TSVs) in 3D IC

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702389 ◽

2013 ◽

Cited By ~ 9

Author(s):

Yang Yi ◽

Yaping Zhou

Keyword(s):

Circuit Model ◽

3D Ic ◽

Through Silicon Vias ◽

Silicon Vias

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Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702338 ◽

2013 ◽

Cited By ~ 4

Author(s):

H. Hashimoto ◽

T. Fukushima ◽

K. W. Lee ◽

M. Koyanagi ◽

T. Tanaka

Keyword(s):

Multicore Processor ◽

Highly Efficient ◽

Repair Technology

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Layout dependent synthesis for manufacturing costs optimized 3D integrated systems

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702349 ◽

2013 ◽

Author(s):

Andy Heinig

Keyword(s):

Integrated Systems ◽

Manufacturing Costs

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High performance 3D stacked DRAM processor architectures with micro-fluidic cooling

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702353 ◽

2013 ◽

Cited By ~ 3

Author(s):

Caleb Serafy ◽

Bing Shi ◽

Ankur Srivastava ◽

Donald Yeung

Keyword(s):

High Performance ◽

Processor Architectures

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Integration of intra chip stack fluidic cooling using thin-layer solder bonding

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702343 ◽

2013 ◽

Cited By ~ 14

Author(s):

Yassir Madhour ◽

Michael Zervas ◽

Gerd Schlottig ◽

Thomas Brunschwiler ◽

Yusuf Leblebici ◽

...

Keyword(s):

Thin Layer

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2013 IEEE International 3D Systems Integration Conference (3DIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor

Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling

Improving 3D-Floorplanning using smart selection operations in meta-heuristic optimization

A scalable multi-dimensional NoC simulation model for diverse spatio-temporal traffic patterns

The monolithic 3D advantage: Monolithic 3D is far more than just an alternative to 0.7x scaling

A novel circuit model for multiple Through Silicon Vias (TSVs) in 3D IC

Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system

Layout dependent synthesis for manufacturing costs optimized 3D integrated systems

High performance 3D stacked DRAM processor architectures with micro-fluidic cooling

Integration of intra chip stack fluidic cooling using thin-layer solder bonding

2013 IEEE International 3D Systems Integration Conference (3DIC)
Latest Publications