Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Weixin Fu; Bo Ma; Hiroyuki Kuwae; Shuichi Shoji; Jun Mizuno

doi:10.7567/jjap.57.02bb01

Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Japanese Journal of Applied Physics ◽

10.7567/jjap.57.02bb01 ◽

2017 ◽

Vol 57 (2S1) ◽

pp. 02BB01 ◽

Cited By ~ 4

Author(s):

Weixin Fu ◽

Bo Ma ◽

Hiroyuki Kuwae ◽

Shuichi Shoji ◽

Jun Mizuno

Keyword(s):

Low Temperature ◽

Self Assembled Monolayer ◽

Self Assembled

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The dynamic behaviour of a single molecule inserted in a self-assembled monolayer matrix at low temperature

Nanotechnology ◽

10.1088/0957-4484/15/4/005 ◽

2004 ◽

Vol 15 (4) ◽

pp. S137-S141 ◽

Cited By ~ 7

Author(s):

Satoshi Wakamatsu ◽

Shintaro Fujii ◽

Uichi Akiba ◽

Masamichi Fujihira

Keyword(s):

Low Temperature ◽

Single Molecule ◽

Dynamic Behaviour ◽

Self Assembled Monolayer ◽

Self Assembled

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Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer

2014 IEEE 2nd International Conference on Emerging Electronics (ICEE) ◽

10.1109/icemelec.2014.7151165 ◽

2014 ◽

Author(s):

Tamal Ghosh ◽

V Siva Rama Krishna ◽

Shiv Govind Singh

Keyword(s):

Low Temperature ◽

Self Assembled Monolayer ◽

Thermocompression Bonding ◽

Self Assembled

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(Invited) Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature

ECS Transactions ◽

10.1149/05007.0115ecst ◽

2013 ◽

Vol 50 (7) ◽

pp. 115-123 ◽

Cited By ~ 9

Author(s):

C. S. Tan ◽

D. F. Lim

Keyword(s):

Low Temperature ◽

Wafer Bonding ◽

Surface Passivation ◽

Self Assembled Monolayer ◽

Self Assembled

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Low temperature bump-less Cu-Cu bonding enhancement with self assembled monolayer (SAM) passivation for 3-D integration

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490639 ◽

2010 ◽

Cited By ~ 13

Author(s):

Dau Fatt Lim ◽

Jun Wei ◽

Chee Mang Ng ◽

Chuan Seng Tan

Keyword(s):

Low Temperature ◽

Self Assembled Monolayer ◽

Self Assembled ◽

Cu Bonding

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Application of self-assembled monolayer (SAM) in low temperature bump-less Cu-Cu bonding for advanced 3D IC

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference ◽

10.1109/impact.2010.5699478 ◽

2010 ◽

Cited By ~ 5

Author(s):

Chuan Seng Tan

Keyword(s):

Low Temperature ◽

Self Assembled Monolayer ◽

3D Ic ◽

Self Assembled ◽

Cu Bonding

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Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Microelectronics Reliability ◽

10.1016/j.microrel.2011.04.003 ◽

2012 ◽

Vol 52 (2) ◽

pp. 321-324 ◽

Cited By ~ 37

Author(s):

C.S. Tan ◽

D.F. Lim ◽

X.F. Ang ◽

J. Wei ◽

K.C. Leong

Keyword(s):

Low Temperature ◽

Bond Strength ◽

Self Assembled Monolayer ◽

Strength Enhancement ◽

Self Assembled

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Surface protection of copper by self assembled monolayer for low-temperature chip bonding

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration ◽

10.1109/ltb-3d.2012.6238050 ◽

2012 ◽

Author(s):

Lijing Qiu ◽

Kiyoaki Nakahara ◽

Akihiro Ikeda ◽

Tanemasa Asano

Keyword(s):

Low Temperature ◽

Self Assembled Monolayer ◽

Surface Protection ◽

Self Assembled

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Low temperature, solution-processed ambipolar field-effect transistors based on polymer/self-assembled monolayer modified InOx hybrid structures for balanced hole and electron mobilities exceeding 1 cm2 V−1 s−1

Organic Electronics ◽

10.1016/j.orgel.2017.01.029 ◽

2017 ◽

Vol 43 ◽

pp. 162-166 ◽

Cited By ~ 4

Author(s):

Sheng Sun ◽

Yuzhi Li ◽

Linfeng Lan ◽

Peng Xiao ◽

Zhenhui Chen ◽

...

Keyword(s):

Low Temperature ◽

Field Effect ◽

Field Effect Transistors ◽

Hybrid Structures ◽

Self Assembled Monolayer ◽

Solution Processed ◽

Temperature Solution ◽

Self Assembled

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Enhancing Cu-Cu Diffusion Bonding at Low Temperature Via Application of Self-assembled Monolayer Passivation

Journal of The Electrochemical Society ◽

10.1149/1.3622478 ◽

2011 ◽

Vol 158 (10) ◽

pp. H1057 ◽

Cited By ~ 15

Author(s):

D. F. Lim ◽

S. K. Goulet ◽

M. Bergkvist ◽

J. Wei ◽

K. C. Leong ◽

...

Keyword(s):

Low Temperature ◽

Diffusion Bonding ◽

Self Assembled Monolayer ◽

Self Assembled

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Cu Surface Passivation with Self-Assembled Monolayer (SAM) and Its Application for Wafer Bonding at Moderately Low Temperature

ECS Meeting Abstracts ◽

10.1149/ma2012-02/40/2964 ◽

2012 ◽

Keyword(s):

Low Temperature ◽

Wafer Bonding ◽

Surface Passivation ◽

Self Assembled Monolayer ◽

Self Assembled

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