In situ arsenic‐doped polycrystalline silicon as a low thermal budget emitter contact for Si/Si1−xGex heterojunction bipolar transistors

1996 ◽  
Vol 68 (2) ◽  
pp. 226-228 ◽  
Author(s):  
C. A. King ◽  
R. W. Johnson ◽  
M. R. Pinto ◽  
H. S. Luftman ◽  
J. Munanka
1990 ◽  
Vol 198 ◽  
Author(s):  
F.H. Ruddell ◽  
B.M. Armstrong ◽  
H.S. Gamble ◽  
K.B. Affolter ◽  
P.B. Moynagh ◽  
...  

ABSTRACTThis paper describes the deposition of in-situ doped N-type silicon carbide layers in a Limited Reaction Processing (LRP) reactor. Silane/propane/ phosphine gas chemistry was used at temperatures less than 1000°C and SIMS, XPS and TEM analysis techniques aided layer characterisation. A low thermal budget deposition process (1 min at 970°C) was employed to form the emitters of Sic/Si heterojunction NPN bipolar transistors. These devices yielded a factor of two increase in emitter Gummel number compared to diffused emitters.


1996 ◽  
Vol 17 (11) ◽  
pp. 503-505 ◽  
Author(s):  
Hsiao-Yi Lin ◽  
Chun-Yen Chang ◽  
Tan Fu Lei ◽  
Feng-Ming Liu ◽  
Wen-Luh Yang ◽  
...  

1999 ◽  
Vol 146 (3) ◽  
pp. 1189-1196 ◽  
Author(s):  
Ibrahim Ban ◽  
Mehmet C. Öztürk ◽  
Veena Misra ◽  
Jimmie J. Wortman ◽  
Dave Venables ◽  
...  

2017 ◽  
Vol 10 (2) ◽  
pp. 026502 ◽  
Author(s):  
Wen-Hsien Huang ◽  
Jia-Min Shieh ◽  
Ming-Hsuan Kao ◽  
Chang-Hong Shen ◽  
Tzu-En Huang ◽  
...  

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