Plasma process induced damage detection by fast wafer level reliability monitoring for automotive applications

2016 ◽  
Vol 64 ◽  
pp. 189-193 ◽  
Author(s):  
D. Beckmeier ◽  
A. Martin
Keyword(s):  
Damage Detection ◽  
Automotive Applications ◽  
Wafer Level ◽  
Plasma Process ◽  
Reliability Monitoring

Fast wafer level reliability monitoring as a tool to achieve automotive quality for a wafer process

2016 ◽  
Vol 64 ◽  
pp. 2-12 ◽  
Author(s):  
A. Martin ◽  
R.-P. Vollertsen ◽  
A. Mitchell ◽  
M. Traving ◽  
D. Beckmeier ◽  
...  
Keyword(s):  
Wafer Level ◽  
Reliability Monitoring

Study of an infrared hybrid chalcogenide silicon lenses compatible with wafer-level manufacturing process for automotive applications

2021 ◽  
Author(s):  
Guillaume Druart ◽  
Florence de la Barrière ◽  
Jean-Baptiste C. G. Volatier ◽  
Elodie Tartas ◽  
Raphaël Proux ◽  
...  
Keyword(s):  
Manufacturing Process ◽  
Automotive Applications ◽  
Wafer Level ◽  
Silicon Lenses
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