Reliability of embedded wafer level ball grid arrays in automotive applications

2017 ◽  
Author(s):  
Michael Novak ◽  
Wolfgang Grubl ◽  
Bernhard Schuch ◽  
Peter Ossimitz
Keyword(s):  
Automotive Applications ◽  
Wafer Level ◽  
Ball Grid Arrays

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

2007 ◽  
Vol 129 (4) ◽  
pp. 382-390 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
John Evans ◽  
Jeff Suhling
Keyword(s):  
Printed Circuit Boards ◽  
Ball Grid Array ◽  
Circuit Boards ◽  
Automotive Applications ◽  
Electronic Components ◽  
Ball Grid Arrays ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Metal Backing

Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher temperatures necessitate the fundamental understanding of damage mechanisms, which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards (PCBs). Automotive applications typically use high glass-transition temperature laminates such as FR4-06 glass∕epoxy laminate material (Tg=164.9°C). In application environments, metal backing of printed circuit boards is being targeted for thermal dissipation, mechanical stability, and interconnections reliability. In this study, the effect of metal-backed boards on the interconnect reliability has been evaluated. Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates (Lall et al., 2003, “Model for BGA and CSP in Automotive Underhood Environments,” Electronic Components and Technology Conference, New Orleans, LA, May 27–30, pp. 189–196;Syed, A. R., 1996, “Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages,” Proceedings of the 1996 Electronic Components and Technology Conference, Orlando, FL, May 28–31, pp. 1211–1216;Evans et al., 1997, “PBGA Reliability for Under-the-Hood Automotive Applications,” Proceedings of InterPACK ’97, Kohala, HI, Jun. 15–19, pp. 215–219;Mawer et al., 1999, “Board-Level Characterization of 1.0 and 1.27mm Pitch PBGA for Automotive Under-Hood Applications,” Proceedings of the 1999 Electronic Components and Technology Conference, San Diego, CA, Jun. 1–4, pp. 118–124) and ceramic ball-grid arrays (BGAs) on non-metal-backed substrates (Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE Trans-CPMT-A, Vol. 15, No. 6, pp. 1013–1024;Darveaux et al., 1995, “Reliability of Plastic Ball Grid Array Assembly,” Ball Grid Array Technology, Lau, J., ed., McGraw-Hill, New York, pp. 379–442;Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proceedings of 50th ECTC, May, pp. 1048–1058). Delamination of PCBs from metal backing has also been investigated. The test vehicle is a metal-backed FR4-06 laminate. The printed circuit board has an aluminum metal backing, attached with pressure sensitive adhesive (PSA). Component architectures tested include plastic ball-grid array devices, C2BGA devices, QFN, and discrete resistors. Reliability of the component architectures has been evaluated for HASL. Crack propagation and intermetallic thickness data have been acquired as a function of cycle count. Reliability data have been acquired on all these architectures. Material constitutive behavior of PSA has been measured using uniaxial test samples. The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested.

Study of an infrared hybrid chalcogenide silicon lenses compatible with wafer-level manufacturing process for automotive applications

2021 ◽  
Author(s):  
Guillaume Druart ◽  
Florence de la Barrière ◽  
Jean-Baptiste C. G. Volatier ◽  
Elodie Tartas ◽  
Raphaël Proux ◽  
...  
Keyword(s):  
Manufacturing Process ◽  
Automotive Applications ◽  
Wafer Level ◽  
Silicon Lenses

Lift up! to IC Packaging: Trends and Assembly Reliability

2016 ◽  
Vol 2016 (S1) ◽  
pp. S1-S28
Author(s):  
Reza Ghaffarian
Keyword(s):  
System Integration ◽  
Paradigm Shift ◽  
Lower Cost ◽  
Semiconductor Industry ◽  
Electronics Packaging ◽  
Brick Wall ◽  
Wafer Level ◽  
New Paradigm ◽  
Ball Grid Arrays ◽  
Ic Packaging

For five decades, the semiconductor industry has distinguished itself from other industries by continuously reducing IC sizes while exponentially increasing functionality (Moore's Law) that enabled IC shrinkage and lower cost. The problem now is that IC shrinkage hit a brick wall, in response, a new paradigm shift is emerged—packaging technologies. Industries now focusing on shrinking the IC packaging through stacking and system integration. This talk presents electronics packaging miniaturization trends from ball grid arrays to wafer level and stack technologies with emphasis on system to package qualification and reliability testing methodologies and results.

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing
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