2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

146

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781728135526

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A study on an abnormal oxidation issue of copper bonding wire

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984848 ◽

2019 ◽

Author(s):

Lois Liao Jinzhi ◽

Song Jianbo ◽

Zhu Lei ◽

Chen Yan ◽

Cho Nan ◽

...

Keyword(s):

Bonding Wire

Download Full-text

Effect of Primary Knocked-on Atoms on Conductivity Compensation in N-type 4H-SiC Irradiated by 1 MeV Electrons, 25 MeV C Ions and 40 MeV Si Ions

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984862 ◽

2019 ◽

Author(s):

Guoliang Ma ◽

Yanqing Zhang ◽

Heyi Li ◽

Chaoming Liu ◽

Chunhua Qi ◽

...

Download Full-text

Investigation of Electrical Parameters Degradations for 600V SOI-LIGBT under Repetitive ESD Stresses

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984813 ◽

2019 ◽

Author(s):

Li Lu ◽

Ran Ye ◽

Siyang Liu ◽

Weifeng Sun

Keyword(s):

Electrical Parameters

Download Full-text

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984907 ◽

2019 ◽

Author(s):

S Sharang ◽

Jiri Dluhos ◽

Dominika Kalasova ◽

Andrey Denisyuk ◽

Rostislav Vana ◽

...

Keyword(s):

Micro Ct ◽

Depth Analysis

Download Full-text

High Resolution Mapping of Defects at SiO2/SiC Interfaces by Local-DLTS Based on Time-Resolved Scanning Nonlinear Dielectric Microscopy

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984905 ◽

2019 ◽

Author(s):

Yuji Yamagishi ◽

Yasuo Cho

Keyword(s):

High Resolution ◽

Time Resolved ◽

Nonlinear Dielectric ◽

High Resolution Mapping ◽

Resolution Mapping

Download Full-text

Analysis of a novel EOS failure due to stray voltage during ICT testing

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984859 ◽

2019 ◽

Author(s):

Weiwei Zhang ◽

Yi Zhang ◽

Yuanxin Lee

Keyword(s):

Stray Voltage

Download Full-text

Leakage Current Degradation in SiC Junction Barrier Schottky Diodes under Heavy Ion Microbeam

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984872 ◽

2019 ◽

Author(s):

Cao Shuang ◽

Yu Qingkui ◽

Du Guanghua ◽

Guo Jinlong ◽

Wang He ◽

...

Keyword(s):

Leakage Current ◽

Schottky Diodes ◽

Heavy Ion

Download Full-text

New Approaches in ESD Risk Measurement of PCB Assembling Machines and ESD Countermeasures

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984855 ◽

2019 ◽

Author(s):

Peter Jacob

Keyword(s):

Risk Measurement ◽

New Approaches

Download Full-text

Enhanced Package Fault Isolation Method Using Time Domain Reflectometry (TDR) Incorporation with Mathematics

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984800 ◽

2019 ◽

Author(s):

Lan Yin Lee ◽

Kok Keng Chua

Keyword(s):

Time Domain ◽

Time Domain Reflectometry ◽

Fault Isolation ◽

Isolation Method

Download Full-text

Endpoint Detection Methods in Implementing AI-assisted Polishing Process

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa47161.2019.8984919 ◽

2019 ◽

Author(s):

Hao TAN ◽

Jacobus LEO ◽

Shreyas M PARAB ◽

Krishnanunni MENON ◽

Yuzhe ZHAO ◽

...

Keyword(s):

Detection Methods ◽

Endpoint Detection ◽

Polishing Process

Download Full-text

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A study on an abnormal oxidation issue of copper bonding wire

Effect of Primary Knocked-on Atoms on Conductivity Compensation in N-type 4H-SiC Irradiated by 1 MeV Electrons, 25 MeV C Ions and 40 MeV Si Ions

Investigation of Electrical Parameters Degradations for 600V SOI-LIGBT under Repetitive ESD Stresses

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

High Resolution Mapping of Defects at SiO2/SiC Interfaces by Local-DLTS Based on Time-Resolved Scanning Nonlinear Dielectric Microscopy

Analysis of a novel EOS failure due to stray voltage during ICT testing

Leakage Current Degradation in SiC Junction Barrier Schottky Diodes under Heavy Ion Microbeam

New Approaches in ESD Risk Measurement of PCB Assembling Machines and ESD Countermeasures

Enhanced Package Fault Isolation Method Using Time Domain Reflectometry (TDR) Incorporation with Mathematics

Endpoint Detection Methods in Implementing AI-assisted Polishing Process

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications