IEEE Transactions on Components Hybrids and Manufacturing Technology
Latest Publications

TOTAL DOCUMENTS

1755

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By Institute Of Electrical And Electronics Engineers

1558-3082, 0148-6411

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Application of quality function deployment to the design of a lithium battery

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.273668 ◽

1993 ◽

Vol 16 (8) ◽

pp. 802-807 ◽

Cited By ~ 9

Author(s):

L. Halbleib ◽

P. Wormington ◽

W. Cieslak ◽

H. Street

Keyword(s):

Quality Function Deployment ◽

Lithium Battery ◽

Quality Function

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Thermal design for high-speed high-density multichip module

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237932 ◽

1993 ◽

Vol 16 (4) ◽

pp. 384-387 ◽

Cited By ~ 9

Author(s):

T. Handa ◽

S. Iida ◽

J. Utsunomiya

Keyword(s):

High Speed ◽

High Density ◽

Thermal Design ◽

Multichip Module

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Thermal analysis of electrode heating and melting due to a spark

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237943 ◽

1993 ◽

Vol 16 (4) ◽

pp. 456-466 ◽

Cited By ~ 11

Author(s):

B.-J. Wang ◽

N. Saka

Keyword(s):

Thermal Analysis

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Large capacitance electric double layer capacitor using activated carbon/carbon composite

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237939 ◽

1993 ◽

Vol 16 (4) ◽

pp. 431-436 ◽

Cited By ~ 7

Author(s):

J. Tabuchi ◽

T. Saito ◽

Y. Kibi ◽

A. Ochi

Keyword(s):

Activated Carbon ◽

Double Layer ◽

Electric Double Layer ◽

Carbon Composite ◽

Electric Double Layer Capacitor ◽

Double Layer Capacitor ◽

Large Capacitance

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Making contact to aged surfaces

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237938 ◽

1993 ◽

Vol 16 (4) ◽

pp. 424-430 ◽

Cited By ~ 5

Author(s):

R.D. Malucci

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Formation of SiO/sub 2/ on contact surface and its effect on contact reliability

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237940 ◽

1993 ◽

Vol 16 (4) ◽

pp. 437-441 ◽

Cited By ~ 10

Author(s):

T. Tamai

Keyword(s):

Contact Surface

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Surface mounting of very fine pitch components: a new challenge

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237937 ◽

1993 ◽

Vol 16 (4) ◽

pp. 402-406

Author(s):

J. Joly ◽

X. Saint-Martin

Keyword(s):

Fine Pitch ◽

Surface Mounting

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Screening ICs on the bare chip level: temporary packaging

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237935 ◽

1993 ◽

Vol 16 (4) ◽

pp. 392-395

Author(s):

D. Chu ◽

C.A. Reber ◽

D.W. Palmer

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Packaging alternatives for high lead count, fine pitch, surface mount technology

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237936 ◽

1993 ◽

Vol 16 (4) ◽

pp. 396-401 ◽

Cited By ~ 4

Author(s):

R.J. Chroneos ◽

D. Mallik ◽

S.D. Prough

Keyword(s):

Surface Mount Technology ◽

Surface Mount ◽

Fine Pitch ◽

High Lead

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Computer-aided planning systems for integrated electronic and mechanical design

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237931 ◽

1993 ◽

Vol 16 (4) ◽

pp. 377-383 ◽

Cited By ~ 5

Author(s):

K. Feldmann ◽

J. Franke

Keyword(s):

Mechanical Design ◽

Planning Systems ◽

Computer Aided ◽

Computer Aided Planning

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IEEE Transactions on Components Hybrids and Manufacturing TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Institute Of Electrical And Electronics Engineers

Application of quality function deployment to the design of a lithium battery

Thermal design for high-speed high-density multichip module

Thermal analysis of electrode heating and melting due to a spark

Large capacitance electric double layer capacitor using activated carbon/carbon composite

Making contact to aged surfaces

Formation of SiO/sub 2/ on contact surface and its effect on contact reliability

Surface mounting of very fine pitch components: a new challenge

Screening ICs on the bare chip level: temporary packaging

Packaging alternatives for high lead count, fine pitch, surface mount technology

Computer-aided planning systems for integrated electronic and mechanical design

IEEE Transactions on Components Hybrids and Manufacturing Technology
Latest Publications