Packaging alternatives for high lead count, fine pitch, surface mount technology

1993 ◽  
Vol 16 (4) ◽  
pp. 396-401 ◽  
Author(s):  
R.J. Chroneos ◽  
D. Mallik ◽  
S.D. Prough
Keyword(s):  
Surface Mount Technology ◽  
Surface Mount ◽  
Fine Pitch ◽  
High Lead

The Integration of a SMT Fully-Automated Rework Cell for Fine-Pitch Surface Mounted Devices

1996 ◽  
Author(s):  
Ismail Fidan ◽  
Larry Ruff ◽  
Stephen Derby
Keyword(s):  
Manufacturing Industry ◽  
Electronics Manufacturing ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
Surface Mount ◽  
Integrated Electronics ◽  
Fine Pitch ◽  
The Common ◽  
The Creation ◽  
Complexity Cost

Abstract Surface mounted components have become the choice of the electronics manufacturing industry to solve problems in the complex circuit boards. New components using increased lead counts on finer pitches make manufacturing difficult. The increased complexity, cost, and lead count of the Surface Mount Technology (SMT) components, and also the increasing compactness of the SMT assemblies have demanded the creation of newer rework tools as an essential part of electronics manufacturing. Therefore, it becomes essential to have a well-controlled process to assure that rework is not only possible but that it is consistent and flawless. Automation is the common answer to achieve both efficiency and quality. This paper describes a system for the automated rework of fine pitch components that is under development as part of the Center for Integrated Electronics and Electronics Manufacturing (CIEEM) at Rensselaer.

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