Surface mounting of very fine pitch components: a new challenge

1993 ◽  
Vol 16 (4) ◽  
pp. 402-406
Author(s):  
J. Joly ◽  
X. Saint-Martin
Keyword(s):  
Author(s):  
Desmond Y. R. Chong ◽  
C. K. Wang ◽  
K. C. Fong ◽  
Pradeep Lall

Reduction in size of portable products such as cellular phones and camcorders has led to the miniaturization of integrated circuit packages. Fine-pitch BGA (FBGA) packages has been gaining its popularity due to compact in size and relatively low costing. With further down-sizing in package height, reliability issues like die cracking and warpage have surfaced as potential failures. Die cracks results in malfunction of an IC package, while the latter causes difficulty in board surface mounting. In this study, effects of package height on the die stress and warpage have been assessed by FEA. With overmold height ranging from 0.4∼0.6mm and substrate from 0.16∼0.32mm thick, the Overall Package Thickness coding from “T” (1.00<A< = 1.20mm) to “W” (0.65<A< = 0.80mm) are being analyzed. Results revealed that die stress and warpage decreases with increase in overmold thickness. However, an increment in the substrate thickness constituted to a rise in die stress and warpage. It was found that “top clearance” (distance between active die side and package top) of the package contributed to different trends in die stresses. Trends of results in varying the package and die sizes are also being investigated. The findings have provided guidelines for in-house designers in containing possible failures in FBGA packages.


Author(s):  
S. G. Grigoriev ◽  
M. V. Kurnosenko ◽  
A. M. Kostyuk

The article discusses possible forms of educational STEM projects in the field of electronics and device control using Arduino controllers. As you know, the implementation of such STEM projects can be carried out not only using various electronic constructors, but also using virtual modeling environments. The knowledge obtained during modeling in virtual environments makes it possible to increase the efficiency of face-to-face practical training with a real constructor, and to improve the quality of students’ knowledge. The use of virtual modeling environments in combination with the use of real constructors provides links between distance and full-time learning. A real constructors can be used simultaneously by both the teacher and the student, jointly practicing the features of solving practical problems. The article provides examples of using a virtual environment for preliminary prototyping of circuits available in the documentation for electronic constructors, to familiarize students with the basics of designing and assembling electronic circuits using the surface mounting method and on a breadboard, as well as programming controllers on the Arduino platform that control electronic devices. This approach allows students to accelerate the assimilation of various interdisciplinary knowledge in the field of natural sciences using STEM design.


Author(s):  
Bob Wettermann

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.


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