Screening ICs on the bare chip level: temporary packaging

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237935 ◽

1993 ◽

Vol 16 (4) ◽

pp. 392-395

Author(s):

D. Chu ◽

C.A. Reber ◽

D.W. Palmer

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