Thermal design for high-speed high-density multichip module

1993 ◽  
Vol 16 (4) ◽  
pp. 384-387 ◽  
Author(s):  
T. Handa ◽  
S. Iida ◽  
J. Utsunomiya
Keyword(s):  
High Speed ◽  
High Density ◽  
Thermal Design ◽  
Multichip Module

Thermal and Mechanical Analysis of a Multichip Module

1992 ◽  
Vol 264 ◽  
Author(s):  
M. S. Hu
Keyword(s):  
High Speed ◽  
Mechanical Analysis ◽  
High Density ◽  
Electrical Performance ◽  
Multichip Module ◽  
Multichip Modules ◽  
Printed Wiring Board ◽  
Proper Design ◽  
Wiring Board ◽  
High Density Packaging

AbstractHigh speed, high density packaging requirements have made multichip modules (MCM) one of the most active areas of research in the electronic industry.High density printed wiring board (PWB) have low production cost and good electrical performance. However, the most questioned issue in application is the reliability. As a result, a thermal and mechanical analysis on a MCM has been conducted to understand its feasibility. The results indicate that with proper design, the components can operate under satisfactory conditions on PWB laminates.

Development of ATC for High Speed and High Density Commuter Line

2007 ◽  
Vol 127 (10) ◽  
pp. 1033-1042
Author(s):  
Tamio Okutani ◽  
Nobuyuki Nakamura ◽  
Hisato Araki ◽  
Shouji Irie ◽  
Hiroki Osa ◽  
...  
Keyword(s):  
High Speed ◽  
High Density

Multichip Module High Speed Testing

1993 ◽  
Author(s):  
Robert J. Davis ◽  
David H. Auston
Keyword(s):  
High Speed ◽  
Multichip Module

A flexible gate array for high speed and high density applications

2002 ◽  
Author(s):  
J. Gallia ◽  
R. Landers ◽  
Ching-Hao Shaw ◽  
T. Blake ◽  
W. Banzhaf
Keyword(s):  
High Speed ◽  
High Density ◽  
Gate Array
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