IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)
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RF de-embedding technique for extracting power MOSFET package parasitics

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885182 ◽

2002 ◽

Cited By ~ 14

Author(s):

E. McShane ◽

K. Shenai

Keyword(s):

Power Mosfet ◽

Embedding Technique

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A comparative study of wire bonding versus solder bumping of power semiconductor devices

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885185 ◽

2002 ◽

Cited By ~ 1

Author(s):

Xingsheng Liu ◽

Xiukuan Jing ◽

Guo-Quan Lu

Keyword(s):

Comparative Study ◽

Semiconductor Devices ◽

Wire Bonding ◽

Power Semiconductor ◽

Power Semiconductor Devices

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Power supply arcing

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885177 ◽

2002 ◽

Cited By ~ 1

Author(s):

P. Singh ◽

S. Mazzuca ◽

Y. Yao ◽

G. Galyon ◽

V. Ronken ◽

...

Keyword(s):

Power Supply

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High power IGBT modules: thermal fatigue resistance evaluation of the solder joints

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885186 ◽

2002 ◽

Cited By ~ 7

Author(s):

J.-M. Thebaud ◽

E. Woirgard ◽

C. Zardini ◽

K.-H. Sommer

Keyword(s):

Fatigue Resistance ◽

Thermal Fatigue ◽

High Power ◽

Solder Joints ◽

Resistance Evaluation ◽

Thermal Fatigue Resistance ◽

Igbt Modules

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Fabrication of thin-film V-groove inductors using composite magnetic materials

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885191 ◽

2002 ◽

Cited By ~ 10

Author(s):

S. Prabhakaran ◽

D.E. Kreider ◽

Yu Lin ◽

C.R. Sullivan ◽

C.G. Levey

Keyword(s):

Thin Film ◽

Magnetic Materials

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A report on packaging implications of advances in capacitor technologies

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885175 ◽

2002 ◽

Cited By ~ 1

Author(s):

W.J. Sarjeant ◽

D.T. Staffiere

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Low stress anhydride molding compound for RF applications

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885187 ◽

2002 ◽

Cited By ~ 1

Author(s):

P.J. Procter ◽

T.R. Miles

Keyword(s):

Molding Compound ◽

Rf Applications

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Present practice of power packaging for DC/DC converters

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885110 ◽

2002 ◽

Cited By ~ 2

Author(s):

J. Flannery ◽

P. Cheasty ◽

M. Meinhardt ◽

M. Ludwig ◽

P. McCloskey ◽

...

Keyword(s):

Present Practice

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Polymer thick film (PTF) and flex technologies for low cost power electronics packaging

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885178 ◽

2002 ◽

Cited By ~ 11

Author(s):

A.B. Lostetter ◽

F. Barlow ◽

A. Elshabini ◽

K. Olejniczak ◽

S. Ang

Keyword(s):

Power Electronics ◽

Thick Film ◽

Low Cost ◽

Electronics Packaging

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Friendly tools for the thermal simulation of power packages

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) ◽

10.1109/iwipp.2000.885181 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Rencz ◽

V. Szekely ◽

A. Poppe ◽

B. Courtois

Keyword(s):

Thermal Simulation

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IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

RF de-embedding technique for extracting power MOSFET package parasitics

A comparative study of wire bonding versus solder bumping of power semiconductor devices

Power supply arcing

High power IGBT modules: thermal fatigue resistance evaluation of the solder joints

Fabrication of thin-film V-groove inductors using composite magnetic materials

A report on packaging implications of advances in capacitor technologies

Low stress anhydride molding compound for RF applications

Present practice of power packaging for DC/DC converters

Polymer thick film (PTF) and flex technologies for low cost power electronics packaging

Friendly tools for the thermal simulation of power packages

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)
Latest Publications