A comparative study of wire bonding versus solder bumping of power semiconductor devices

Author(s):  
Xingsheng Liu ◽  
Xiukuan Jing ◽  
Guo-Quan Lu
2014 ◽  
Vol 134 (6) ◽  
pp. 432-433
Author(s):  
Masahiro Sato ◽  
Akiko Kumada ◽  
Kunihiko Hidaka ◽  
Keisuke Yamashiro ◽  
Yuji Hayase ◽  
...  

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